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BZX84C56LT1G - onsemi

Description: 250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB

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Symbol
BZX84C56LT1G - onsemi - PCB symbol
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PCB Footprints
BZX84C56LT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08
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3D Models
BZX84C56LT1G - onsemi - 3D model - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08
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BZX84C56LT1G Details

  • Manufacturer Part Number:

    BZX84C56LT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.1

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    200 Ω

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.25 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Reference Voltage-Nom:

    56 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    7.14%

  • Working Test Current:

    2 mA

BZX84C56LT1G Frequently Asked Questions (FAQs)

  • The recommended land pattern for the BZX84C56LT1G is a rectangular pad with a size of 0.6 mm x 0.3 mm, with a solder mask clearance of 0.1 mm. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
  • The BZX84C56LT1G is an ESD-sensitive device. To handle ESD sensitivity, it is recommended to use an ESD wrist strap or mat, and to handle the device by the body or leads, avoiding direct contact with the die. It is also recommended to use ESD-protective packaging and to follow proper ESD handling procedures.
  • The maximum power dissipation of the BZX84C56LT1G is 500 mW. However, the actual power dissipation may be limited by the thermal resistance of the device and the ambient temperature. It is recommended to derate the power dissipation based on the ambient temperature and the thermal resistance of the device.
  • Yes, the BZX84C56LT1G is suitable for high-reliability applications. It is manufactured using a high-reliability process and is screened to ensure high reliability. However, it is recommended to follow proper design and manufacturing practices to ensure the reliability of the final product.
  • The correct voltage rating for the BZX84C56LT1G depends on the specific application and the maximum voltage that the device will be exposed to. The BZX84C56LT1G has a maximum voltage rating of 56 V, but it is recommended to derate the voltage rating based on the ambient temperature and the expected voltage transients.

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BZX84C56LT1G Overview

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