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BZX84C7V5LT1G - onsemi

Description: 250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB

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PCB Footprints
BZX84C7V5LT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08 ISSUE AS
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3D Models
BZX84C7V5LT1G - onsemi  - 3D model - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08 ISSUE AS
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BZX84C7V5LT1G Details

  • Manufacturer Part Number:

    BZX84C7V5LT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • YTEOL:

    7.1

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    15 Ω

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.25 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Reference Voltage-Nom:

    7.5 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    6.04%

  • Working Test Current:

    5 mA

BZX84C7V5LT1G Frequently Asked Questions (FAQs)

  • The recommended land pattern for the BZX84C7V5LT1G is a rectangular pad with a size of 0.6 mm x 0.3 mm, with a solder mask clearance of 0.1 mm. The pad should be centered on the component.
  • To handle the ESD sensitivity of the BZX84C7V5LT1G, it is recommended to use ESD protection devices, such as TVS diodes, and to follow proper handling and storage procedures to prevent ESD damage.
  • The maximum operating temperature range for the BZX84C7V5LT1G is -65°C to 150°C, with a derating of 1.33 mW/°C above 25°C.
  • Yes, the BZX84C7V5LT1G is suitable for high-reliability applications, such as aerospace, automotive, and industrial control systems, due to its high reliability and long lifespan.
  • To ensure the BZX84C7V5LT1G is properly soldered, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes thermal stress and avoids overheating the component.

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BZX84C7V5LT1G Overview

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Part Image BZX84C7V5TC Zetex / Diodes Inc

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Part Image BZX84-C7V5 Microsemi Corporation (now Microchip)

Zener Diode, 0.35W, Silicon, Unidirectional

Part Image BZX84C7V5L Motorola Semiconductor Products

Zener Diode, 7.5V V(Z), 0.225W, Silicon, Unidirectional, TO-236AB

Part Image BZX84-C7V5 TDK Micronas GmbH

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Part Image BZX84C7V5LT3 onsemi

Zener Diode, 7.5V V(Z), 6.04%, 0.225W, Silicon, Unidirectional, TO-236AB

For a full list of alternate parts for BZX84C7V5LT1G, check out Findchips.com