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BZX84C8V2-TP - MCC

Description: Zener Diodes

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PCB Footprints
BZX84C8V2-TP - MCC PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23-ren20
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3D Models
BZX84C8V2-TP - MCC  - 3D model - SOT23 (3-Pin) - SOT-23-ren20
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BZX84C8V2-TP Details

  • Manufacturer Part Number:

    BZX84C8V2-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    PACKAGE-3

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6.7

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    15 Ω

  • Forward Voltage-Max (VF):

    0.9 V

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    80 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.35 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    8.2 V

  • Reverse Current-Max:

    0.7 µA

  • Reverse Test Voltage:

    5 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    5 mA

BZX84C8V2-TP Frequently Asked Questions (FAQs)

  • The recommended soldering temperature for the BZX84C8V2-TP is between 240°C to 260°C for a maximum of 5 seconds.
  • Yes, the BZX84C8V2-TP is a low-capacitance diode, making it suitable for high-frequency applications up to several hundred MHz.
  • The typical reverse recovery time of the BZX84C8V2-TP is around 2-5 ns, making it suitable for high-speed switching applications.
  • No, the BZX84C8V2-TP is not a radiation-hardened device. It is not designed for use in high-radiation environments.
  • The maximum allowable power dissipation of the BZX84C8V2-TP is 500 mW, and it is recommended to derate the power dissipation based on the ambient temperature.

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BZX84C8V2-TP Overview

Use the download button to access the BZX84C8V2-TP schematic symbol, PCB footprint, and 3D model.
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Part Image BZX84C8V2-E3-08 Vishay Intertechnologies

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Part Image BZX84-C8V2/T3 NXP Semiconductors

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Part Image BZX84C8V2TRL NXP Semiconductors

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Part Image BZX84C8V2-7 Diodes Incorporated

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For a full list of alternate parts for BZX84C8V2-TP, check out Findchips.com