Description:250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB
The recommended land pattern for the BZX84C8V2LT1G is a rectangular pad with a size of 0.6 mm x 0.3 mm, with a solder mask clearance of 0.1 mm. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
The BZX84C8V2LT1G is an ESD-sensitive device. To handle ESD sensitivity, it is recommended to use an ESD wrist strap or mat, and to handle the device by the body or leads, avoiding touching the pins. It is also recommended to use ESD-protected equipment and to follow proper ESD handling procedures.
The maximum power dissipation of the BZX84C8V2LT1G is 500 mW. However, the actual power dissipation may vary depending on the operating conditions and the thermal resistance of the device. It is recommended to derate the power dissipation based on the ambient temperature and the thermal resistance of the device.
Yes, the BZX84C8V2LT1G is suitable for use in high-reliability applications. It is manufactured using a high-reliability process and is screened to ensure high reliability. However, it is recommended to follow proper design and manufacturing practices to ensure the reliability of the final product.
The BZX84C8V2LT1G should be stored in a dry, cool place, away from direct sunlight and moisture. It is recommended to store the device in its original packaging or in a sealed bag to prevent moisture absorption. The device should not be exposed to temperatures above 40°C or humidity above 60%.
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BZX84C8V2LT1G Overview
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