BZX85C20 - onsemi

BZX85C20 Frequently Asked Questions (FAQs)

• What is the recommended land pattern for the BZX85C20?
  The recommended land pattern for the BZX85C20 is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a solder mask clearance of 0.1 mm. The pad should be centered on the component and have a thermal relief connection to the ground plane.
• How do I handle the BZX85C20's high surge current capability in my design?
  To handle the BZX85C20's high surge current capability, ensure that your PCB design can handle the high current pulses. This may involve using thicker traces, wider spacing between components, and adding surge protection devices such as TVS diodes or varistors.
• Can I use the BZX85C20 in a high-temperature environment?
  The BZX85C20 is rated for operation up to 150°C, but its performance may degrade at high temperatures. Ensure that your design takes into account the device's temperature coefficient and provides adequate heat sinking to prevent overheating.
• How do I select the correct BZX85C20 variant for my application?
  Select the correct BZX85C20 variant based on your application's voltage and current requirements. The BZX85C20 is available in different voltage ratings (e.g., 20V, 30V, 40V) and package options (e.g., SOD123, SOD323). Consult the datasheet and onsemi's website for more information.
• What is the BZX85C20's equivalent series resistance (ESR) and how does it affect my design?
  The BZX85C20's ESR is typically around 1-2 ohms. ESR affects the device's impedance and can impact the performance of your design, particularly in high-frequency applications. Ensure that your design takes into account the ESR and its impact on the overall system impedance.