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BZX884-B33,315 - Nexperia

Description: Zener Diode 33 V 250 mW ±2% Surface Mount DFN1006-2

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BZX884-B33,315 - Nexperia - PCB symbol
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BZX884-B33,315 - Nexperia PCB footprint - Other - Other - BZX884-B33,315-1
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BZX884-B33,315 - Nexperia - 3D model - Other - BZX884-B33,315-1
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BZX884-B33,315 Details

  • Manufacturer Part Number:

    BZX884-B33,315

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Package Description:

    SOD-882, DFN1006-2, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD882

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    7

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    80 Ω

  • JESD-30 Code:

    R-PBCC-N2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    325 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.25 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-60134

  • Reference Voltage-Nom:

    33 V

  • Reverse Current-Max:

    0.05 µA

  • Reverse Test Voltage:

    23.1 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    TIN

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Temp Coeff-Max:

    29.7 mV/°C

  • Voltage Tol-Max:

    2%

  • Working Test Current:

    2 mA

BZX884-B33,315 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the BZX884-B33,315 is a rectangular pad with a size of 0.8 mm x 1.2 mm, with a solder mask opening of 0.6 mm x 0.8 mm. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
  • The BZX884-B33,315 has a thermal resistance of 300 K/W. To handle thermal considerations, ensure good thermal conduction by using a thermal pad or a heat sink, and avoid overheating by keeping the junction temperature below 150°C.
  • The recommended soldering profile for the BZX884-B33,315 is a peak temperature of 260°C, with a dwell time of 30-60 seconds above 217°C. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.
  • Yes, the BZX884-B33,315 is suitable for high-reliability applications. It is manufactured using a high-reliability process and is qualified to AEC-Q101, which ensures its performance and reliability in harsh environments.
  • To ensure the BZX884-B33,315 is properly biased, connect the anode to a stable voltage source and the cathode to a current-limiting resistor. The recommended bias voltage is between 2.4 V and 37 V, and the recommended bias current is between 1 mA and 100 mA.

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BZX884-B33,315 Overview

Use the download button to access the BZX884-B33,315 schematic symbol, PCB footprint, and 3D model.
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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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