Bivar recommends a PCB layout with a solid ground plane and a thermal relief pattern under the device to ensure efficient heat dissipation. A minimum of 1 oz copper thickness is recommended, and the device should be placed on a thermal pad with a thermal conductivity of at least 1 W/m-K.
Bivar recommends using a soldering temperature of 250°C (max) and a soldering time of 3 seconds (max) to avoid damaging the device. A soldering iron with a temperature control and a fine tip is recommended. Additionally, the device should be handled by the edges to prevent damage to the LEDs.
The recommended drive current for the C-101 is 20mA (max) per LED, and the recommended voltage is 2.0V (typ) per LED. Exceeding these ratings may reduce the lifespan of the device or cause damage.
Bivar recommends using a shielded cable or a twisted pair cable to connect the C-101 to the driver circuit. Additionally, a common-mode choke or a ferrite bead can be used to filter out high-frequency noise. The device should also be placed at least 10mm away from other components to reduce EMI.
The C-101 has an MSL rating of 3, which means it can be exposed to a maximum of 30°C/60% RH for 168 hours. To prevent moisture-related damage, the device should be stored in a dry environment, and the packaging should be opened only when the device is ready to be assembled.
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C-101 Overview
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