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C2M0045170D - Wolfspeed

Description: 1700 V, 45 mΩ, TO-247-3 package, Industrial qualified, Discrete SiC MOSFET

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Symbol
C2M0045170D - Wolfspeed - PCB symbol
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PCB Footprints
C2M0045170D - Wolfspeed PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247-3L
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3D Models
C2M0045170D - Wolfspeed - 3D model - Transistor Outline, Vertical - TO-247-3L
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C2M0045170D Details

  • Manufacturer Part Number:

    C2M0045170D

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • Manufacturer:

    Wolfspeed

  • YTEOL:

    0

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    1700 V

  • Drain Current-Max (ID):

    75 A

  • Drain-source On Resistance-Max:

    0.07 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    6.7 pF

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    338 W

  • Pulsed Drain Current-Max (IDM):

    160 A

  • Reference Standard:

    IEC-60747-8-4

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON CARBIDE

C2M0045170D Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal via array underneath the device is recommended. The thermal vias should be connected to a solid copper plane on the bottom layer to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended junction temperature (Tj) range of -40°C to 150°C. Implement a thermal management system, such as a heat sink or fan, to maintain a safe operating temperature.
  • A gate drive voltage of 15-20V and a current of 1-2A is recommended for optimal switching performance. However, the specific requirements may vary depending on the application and circuit design.
  • Implement overvoltage protection (OVP) and overcurrent protection (OCP) circuits in the system design. Use a voltage regulator or a TVS diode to protect against overvoltage, and a current sense resistor or a fuse to protect against overcurrent.
  • Use a wire bonding technique with a gold or aluminum wire, and follow the recommended bonding parameters. For soldering, use a solder with a melting point above 220°C, and follow the recommended soldering profile.

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C2M0045170D Overview

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