Wolfspeed recommends a PCB layout with a thermal pad connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended, and the thermal pad should be connected to a heat sink or a metal core PCB for optimal thermal performance.
To ensure reliable wire bonding, Wolfspeed recommends using a wire bond process with a minimum bond force of 20-30 grams and a bond temperature of 150-180°C. The wire should be made of gold or aluminum with a diameter of 0.7-1.0 mil. Additionally, the device should be cleaned and prepared according to Wolfspeed's recommended procedures.
The maximum allowable voltage stress on the C3D06060G-TR is 120% of the rated voltage for a maximum of 100 ms. Exceeding this voltage stress can lead to device degradation or failure.
Wolfspeed recommends handling the device with ESD-protective materials and equipment, such as wrist straps, mats, and bags. The device should be stored in a protective package or bag when not in use, and ESD-sensitive areas should be avoided during handling and assembly.
Wolfspeed recommends storing the device in a dry, cool place away from direct sunlight and moisture. The device should be stored in its original packaging or a similar protective package, and should not be exposed to temperatures above 30°C or humidity above 60%.
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C3D06060G-TR Overview
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