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C3D06060G - Wolfspeed

Description: 600 V, 6 A, TO-263-2 package, Industrial qualified, Discrete SiC Schottky Diode

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PCB Footprints
C3D06060G - Wolfspeed PCB footprint - Other - Other -  TO-263-2-2025_5
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C3D06060G - Wolfspeed  - 3D model - Other -  TO-263-2-2025_5
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C3D06060G Details

  • Manufacturer Part Number:

    C3D06060G

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Country Of Origin:

    Mainland China, Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Wolfspeed

  • YTEOL:

    0

  • Additional Feature:

    FREE WHEELING DIODE, PD-CASE

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON CARBIDE

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.7 V

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    49 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    19 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    245

  • Power Dissipation-Max:

    91 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    33 µA

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

C3D06060G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal via array underneath the device is recommended. The thermal vias should be connected to a solid copper plane on the bottom layer to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermally conductive interface material, and follow the recommended PCB layout. Also, derate the device's power handling capability according to the temperature derating curve in the datasheet.
  • The maximum allowable voltage transient is 10% above the maximum rated voltage (VDS) for a duration of ≤ 100 ns. Exceeding this may cause device damage or degradation.
  • Yes, but ensure that the device is properly snubbed to limit voltage spikes. A snubber circuit can be used to reduce voltage transients and prevent device damage.
  • Handle the device in an ESD-controlled environment, use ESD-protective packaging, and ensure that the device is properly grounded during handling and assembly.

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C3D06060G Overview

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