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C3D20065D - Wolfspeed

Description: 650 V, 20 A, TO-247-3 package, Industrial qualified, Discrete SiC Schottky Diode

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C3D20065D - Wolfspeed PCB footprint - Other - Other - TO-247-3_2025-9
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C3D20065D - Wolfspeed  - 3D model - Other - TO-247-3_2025-9
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C3D20065D Details

  • Manufacturer Part Number:

    C3D20065D

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Wolfspeed

  • YTEOL:

    0

  • Additional Feature:

    PD-CASE

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON CARBIDE

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.8 V

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    71 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    29.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    136.3 W

  • Rep Pk Reverse Voltage-Max:

    650 V

  • Reverse Current-Max:

    60 µA

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

C3D20065D Frequently Asked Questions (FAQs)

  • The maximum operating temperature for the C3D20065D is 175°C, as specified in the datasheet. However, it's recommended to operate the device at a temperature below 150°C for optimal performance and reliability.
  • To ensure proper biasing, follow the recommended biasing scheme outlined in the datasheet. Typically, this involves applying a voltage source to the gate terminal and a current source to the drain terminal. Additionally, ensure the device is operated within the recommended voltage and current ranges.
  • For optimal thermal performance, it's recommended to use a PCB with a thermal via or a heat sink attached to the device. Ensure the PCB layout provides a low-impedance path for the drain and source connections. A thermal interface material (TIM) can also be used to improve heat transfer between the device and the heat sink.
  • To protect the C3D20065D from ESD, handle the device in an ESD-controlled environment, and use ESD-protective packaging and handling materials. Ensure that all equipment and tools used during assembly and testing are properly grounded and ESD-protected.
  • Follow the recommended soldering and assembly techniques outlined in the datasheet. Use a soldering iron with a temperature-controlled tip, and ensure the device is properly secured to the PCB using a suitable adhesive or mechanical fastening method.

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C3D20065D Overview

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