Wolfspeed recommends a PCB layout with a thermal pad connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended, and the thermal pad should be connected to a heat sink or a metal core PCB for optimal thermal performance.
To ensure reliable wire bonding, Wolfspeed recommends using a wire bond process with a minimum bond force of 20-30 grams and a bond temperature of 150-180°C. The wire should be made of a material with a melting point above 200°C, such as gold or aluminum.
Wolfspeed recommends limiting voltage transients on the drain-source voltage to less than 10% of the maximum rated voltage (100V) to prevent damage to the device. Transients should be limited to less than 10ns in duration to prevent overheating.
Wolfspeed recommends following standard ESD precautions during handling and assembly, including using ESD-safe materials, grounding personnel and equipment, and using ESD-protective packaging. The device should be handled in a static-controlled environment, and ESD-sensitive areas should be protected with ESD shielding.
Wolfspeed recommends storing the device in a dry, cool place away from direct sunlight and moisture. The device should be stored in its original packaging or in a similar ESD-protective package. Handling should be minimized, and the device should be inspected for damage before use.
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C6D10170H Overview
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