SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR
DS Breakdown Voltage-Min:
1200 V
Drain Current-Max (ID):
200 A
Drain-source On Resistance-Max:
0.0069 Ω
FET Technology:
METAL-OXIDE SEMICONDUCTOR
Feedback Cap-Max (Crss):
43 pF
JESD-30 Code:
R-XUFM-X38
Number of Elements:
2
Number of Terminals:
38
Operating Mode:
ENHANCEMENT MODE
Operating Temperature-Max:
150 °C
Operating Temperature-Min:
-40 °C
Package Body Material:
UNSPECIFIED
Package Shape:
RECTANGULAR
Package Style:
FLANGE MOUNT
Peak Reflow Temperature (Cel):
NOT SPECIFIED
Polarity/Channel Type:
N-CHANNEL
Power Dissipation-Max (Abs):
0.01 W
Pulsed Drain Current-Max (IDM):
400 A
Reference Standard:
IEC-60747-8-4
Surface Mount:
NO
Terminal Form:
UNSPECIFIED
Terminal Position:
UPPER
Time@Peak Reflow Temperature-Max (s):
NOT SPECIFIED
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON CARBIDE
CAB006A12GM3 Frequently Asked Questions (FAQs)
Wolfspeed recommends a PCB layout with a thermal pad connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended, and the thermal pad should be connected to a heat sink or a metal core PCB for optimal thermal performance.
To ensure reliable wire bonding, Wolfspeed recommends using a wire bond process with a minimum bond force of 20 grams and a maximum bond temperature of 150°C. The wire bond pads should be clean and free of oxidation, and the wire should be made of a material with a melting point above 200°C, such as gold or aluminum.
While the datasheet specifies a maximum junction temperature of 150°C, Wolfspeed recommends operating the device at a maximum case temperature of 125°C to ensure reliable operation and minimize degradation over time.
Wolfspeed recommends handling the device with ESD-sensitive precautions, such as using an ESD wrist strap or mat, and storing the device in an ESD-protective package. The device has built-in ESD protection, but additional precautions are recommended to prevent damage during handling and assembly.
Wolfspeed recommends storing the device in a dry, cool place, away from direct sunlight and moisture. The device should be stored in its original packaging or an ESD-protective package, and should not be exposed to temperatures above 30°C or humidity above 60%.
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CAB006A12GM3 Overview
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