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CAT16-2203F4LF - Bourns

Description: Chip Resistor Array

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Symbol
CAT16-2203F4LF - Bourns - PCB symbol
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PCB Footprints
CAT16-2203F4LF - Bourns PCB footprint - Other - Other - CAT16_F4
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3D Models
CAT16-2203F4LF - Bourns - 3D model - Other - CAT16_F4
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CAT16-2203F4LF Details

  • Manufacturer Part Number:

    CAT16-2203F4LF

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    8

  • Construction:

    Rectangular

  • Element Power Dissipation:

    0.0625 W

  • First Element Resistance:

    220000 Ω

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Network Type:

    ISOLATED

  • Number of Elements:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.5 mm

  • Package Length:

    3.2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, PAPER, 7 INCH

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Resistance:

    220000 Ω

  • Resistor Type:

    ARRAY/NETWORK RESISTOR

  • Second/Last Element Resistance:

    220000 Ω

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Temperature Coefficient:

    200 ppm/°C

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    50 V

CAT16-2203F4LF Frequently Asked Questions (FAQs)

  • Bourns recommends a symmetrical PCB layout with a solid ground plane, and keeping the input and output traces as short as possible to minimize parasitic inductance and capacitance. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • Bourns recommends using a reflow soldering process with a peak temperature of 260°C (500°F) for 20-30 seconds. The device should be mounted on a PCB with a solder mask and a solder land pattern that matches the device's footprint. Ensure the device is properly aligned and seated on the PCB before soldering.
  • The CAT16-2203F4LF is rated for operation from -40°C to 125°C (junction temperature). However, the device's performance may degrade at temperatures above 85°C, and it's recommended to derate the device's power handling accordingly.
  • The CAT16-2203F4LF is designed to meet the requirements of IEC 60068-2-27 for vibration and IEC 60068-2-29 for shock. However, it's recommended to perform additional testing and validation to ensure the device meets the specific requirements of your application.
  • Bourns recommends following a systematic troubleshooting approach, starting with visual inspection of the device and PCB for signs of damage or contamination. Next, check the device's input and output voltages, currents, and temperatures using a multimeter and thermal imaging camera. If the issue persists, contact Bourns' technical support for further assistance.

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CAT16-2203F4LF Overview

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