A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2 oz copper thickness and a thermal relief pattern are recommended. Refer to the onsemi application note AND8036/D for more details.
Use a soft-start circuit to limit inrush current and ensure reliable start-up. Also, consider adding input voltage monitoring and UVLO (Under-Voltage Lockout) to prevent malfunction during power-up and power-down.
Use a shielded inductor, keep the switching node (SW) away from sensitive nodes, and add a common-mode choke to reduce EMI. Ensure the PCB layout follows good EMI design practices, and consider adding EMI filters if necessary.
Use the shutdown pin to disable the device during standby mode. Ensure the input voltage is removed or reduced to minimize quiescent current. Consider using a low-dropout regulator or a low-power mode to reduce standby power consumption.
Use high-reliability components, such as X7R or X5R capacitors, and ensure the input capacitor is rated for the maximum input voltage. Consider adding over-voltage protection (OVP) and over-current protection (OCP) to prevent damage from fault conditions.
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