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CAT874-80ULGT3 - onsemi

Description: Obsolete - Precision Analog Voltage Reference

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PCB Footprints
CAT874-80ULGT3 - onsemi PCB footprint - Small Outline No-lead - Small Outline No-lead - ULLGA6 1.45x1.0, 0.5P
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3D Models
CAT874-80ULGT3 - onsemi  - 3D model - Small Outline No-lead - ULLGA6 1.45x1.0, 0.5P
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CAT874-80ULGT3 Details

  • Manufacturer Part Number:

    CAT874-80ULGT3

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    ULLGA6 1.45x1.0, 0.50P

  • Package Description:

    1.45 X 1 MM, 0.40 MM HEIGHT, 0.50 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, ULLGA-6

  • Pin Count:

    6

  • Manufacturer Package Code:

    613AF

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    R-XBGA-B6

  • JESD-609 Code:

    e4

  • Length:

    1.45 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFLGA

  • Package Equivalence Code:

    SOLCC6,.04,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.4 mm

  • Supply Current-Max (Isup):

    0.05 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.8 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    BUTT

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1 mm

CAT874-80ULGT3 Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2 oz copper thickness and a thermal relief pattern are suggested. Refer to the onsemi application note AND8031/D for more details.
  • Ensure the device operates within the recommended junction temperature (TJ) range of -40°C to 150°C. Implement proper thermal management, such as heat sinks or thermal interfaces, to maintain a safe TJ. Monitor the device's thermal performance and adjust the system design accordingly.
  • Follow the onsemi ESD protection guidelines, which include using ESD-sensitive device handlers, wrist straps, and mats. Ensure the device is handled in an ESD-controlled environment, and consider adding external ESD protection devices if necessary.
  • Yes, the CAT874-80ULGT3 is qualified for automotive and high-reliability applications. However, ensure you follow the onsemi automotive qualification process and guidelines for your specific application.
  • Consult the onsemi troubleshooting guide AND8032/D, which provides a step-by-step approach to identifying and resolving common issues. Additionally, contact onsemi's technical support team for further assistance.

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