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CAV24C32C4CTR - onsemi

Description: Automotive Temperature Grade 1 (-40°C to +125°C); Supports Standard and Fast I2C Protocol; 2.5 V to 5.5 V Supply Voltage Range; 32-Byte Page Write Buffer; Hardware Write Protection for Entire Memory; CAV Prefix for Automotive and Other Applications Requiring Site and Change Control; Schmitt Triggers and Noise Suppression Filters on I2C Bus Inputs(SCL and SDA); Low Power CMOS Technology; 1,000,000 Program/Erase Cycles; 100 Year Data Retention; SOIC, TSSOP 8-lead Packages; This Device is Pb-Free, Halogen Free

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PCB Footprints
CAV24C32C4CTR - onsemi PCB footprint - Other - Other - WLCSP4, 0.77x0.77 CASE 567JY ISSUE C
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3D Models
CAV24C32C4CTR - onsemi  - 3D model - Other - WLCSP4, 0.77x0.77 CASE 567JY ISSUE C
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CAV24C32C4CTR Details

  • Manufacturer Part Number:

    CAV24C32C4CTR

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WLCSP-4

  • Package Description:

    WLCSP-4

  • Manufacturer Package Code:

    567JY

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    20 Weeks

  • Date Of Intro:

    2016-02-22

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Clock Frequency-Max (fCLK):

    0.4 MHz

  • JESD-30 Code:

    S-PBGA-B4

  • JESD-609 Code:

    e2

  • Length:

    0.76 mm

  • Memory Density:

    32768 bit

  • Memory IC Type:

    EEPROM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    4

  • Number of Words:

    4096 words

  • Number of Words Code:

    4000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    4KX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.35 mm

  • Serial Bus Type:

    I2C

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin/Silver (Sn/Ag)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    0.76 mm

  • Write Cycle Time-Max (tWC):

    5 ms

CAV24C32C4CTR Frequently Asked Questions (FAQs)

  • A good PCB layout for the CAV24C32C4CTR involves keeping the input and output traces short and symmetrical, using a solid ground plane, and placing decoupling capacitors close to the device. It's also recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper powering and decoupling, use a high-quality power supply with low ripple and noise, and add decoupling capacitors (e.g., 0.1uF and 10uF) close to the device's power pins. Additionally, use a 10nF capacitor between the VCC and GND pins to filter out high-frequency noise.
  • The CAV24C32C4CTR can operate up to 100 MHz, but the actual maximum frequency depends on the specific application, PCB layout, and signal integrity. It's recommended to consult the datasheet and perform simulations to determine the optimal operating frequency for your specific design.
  • To manage thermal issues, ensure good airflow around the device, use a heat sink if necessary, and avoid blocking the airflow around the device. The CAV24C32C4CTR has a thermal pad on the bottom, so use a thermal interface material (TIM) to improve heat transfer. Monitor the device's junction temperature (TJ) and ensure it stays within the recommended operating range.
  • The CAV24C32C4CTR has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. To prevent latch-up, ensure that the device is powered up and down slowly, and avoid voltage spikes or transients on the power supply lines.

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CAV24C32C4CTR Overview

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