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CC1210KKX5RGBB106 - Yageo Group

Description: Multilayer Ceramic Capacitors MLCC - SMD/SMT 10uF 6.3V X5R 5%

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CC1210KKX5RGBB106 - Yageo Group PCB footprint - Capacitor Chip Non-polarised - Capacitor Chip Non-polarised - CC1206_2022-4----
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CC1210KKX5RGBB106 - Yageo Group  - 3D model - Capacitor Chip Non-polarised - CC1206_2022-4----
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CC1210KKX5RGBB106 Details

  • Manufacturer Part Number:

    CC1210KKX5RGBB106

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.24.00.20

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    YAGEO Corporation

  • YTEOL:

    7.44

  • Capacitance:

    10 µF

  • Capacitor Type:

    CERAMIC CAPACITOR

  • Dielectric Material:

    CERAMIC

  • Height:

    2.5 mm

  • JESD-609 Code:

    e3

  • Length:

    3.2 mm

  • Mounting Feature:

    SURFACE MOUNT

  • Multilayer:

    YES

  • Negative Tolerance:

    10%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Style:

    SMT

  • Packing Method:

    TR, EMBOSSED PLASTIC, 7 INCH

  • Positive Tolerance:

    10%

  • Rated (DC) Voltage (URdc):

    35 V

  • Size Code:

    1210

  • Surface Mount:

    YES

  • Temperature Characteristics Code:

    X5R

  • Temperature Coefficient:

    15% ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Width:

    2.5 mm

CC1210KKX5RGBB106 Frequently Asked Questions (FAQs)

  • The recommended land pattern for CC1210KKX5RGBB106 is a rectangular pad with a size of 2.5mm x 1.25mm, with a non-solder mask defined (NSMD) pad shape.
  • To handle thermal stress, ensure that the component is subjected to a gradual temperature increase during reflow soldering, and avoid exposing it to rapid temperature changes. A temperature profile with a peak temperature of 260°C and a dwell time of 20-30 seconds is recommended.
  • The MSL of CC1210KKX5RGBB106 is MSL 2, which means it can withstand a maximum exposure of 4 days in a humidity-controlled environment before soldering.
  • Yes, CC1210KKX5RGBB106 is suitable for high-frequency applications up to 1 GHz due to its low equivalent series resistance (ESR) and high self-resonant frequency.
  • To ensure reliability, operate CC1210KKX5RGBB106 within its specified temperature range (-55°C to 125°C), and avoid exposing it to temperatures above 150°C during soldering or operation.

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CC1210KKX5RGBB106 Overview

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Part Image C1210C106K6PAC7210 KEMET Corporation

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Part Image C1210C106K6PAC7215 KEMET Corporation

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Part Image GRM32ER6YA106KA12B Murata Manufacturing Co Ltd

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For a full list of alternate parts for CC1210KKX5RGBB106, check out Findchips.com