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CC1312R74T0RGZR - Texas Instruments

Description: IC RF TxRx + MCU Bluetooth Bluetooth v5.2, Thread, Wireless M-Bus, Zigbee® 287MHz ~ 351MHz, 359MHz ~ 439MHz, 431MHz ~ 527MHz, 861MHz ~ 1.054GHz, 1.076GHz ~ 1.315GHz 48-VFQFN Exposed Pad

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PCB Footprints
CC1312R74T0RGZR - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RGZ0048A
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3D Models
CC1312R74T0RGZR - Texas Instruments  - 3D model - Quad Flat No-Lead - RGZ0048A
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CC1312R74T0RGZR Details

  • Manufacturer Part Number:

    CC1312R74T0RGZR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.50

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M4F

  • Clock Frequency-Max:

    48 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • Format:

    FLOATING-POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PQCC-N48

  • JESD-609 Code:

    e4

  • Length:

    7 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    32

  • Number of I/O Lines:

    30

  • Number of Serial I/Os:

    2

  • Number of Terminals:

    48

  • Number of Timers:

    4

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC48,.27SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    147456

  • ROM (words):

    720896

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1 mm

  • Speed:

    48 MHz

  • Supply Voltage-Max:

    3.8 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

CC1312R74T0RGZR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout guide in the CC1312R74T0RGZR documentation, which includes guidelines for component placement, trace routing, and ground plane design to ensure optimal RF performance.
  • To optimize power consumption, use the device's low-power modes (e.g., shutdown, standby, and sleep modes), adjust the clock frequency, and use power-saving features like dynamic voltage scaling. Additionally, optimize the firmware to minimize active mode operation and use low-power peripherals.
  • The CC1312R74T0RGZR has an operating temperature range of -40°C to 85°C, but it's essential to consider the specific application's requirements and ensure the device is operated within the recommended temperature range to maintain reliability and performance.
  • To ensure EMC, follow the guidelines in the CC1312R74T0RGZR documentation, including using a shielded enclosure, minimizing trace lengths, and using EMC-compliant components. Additionally, perform EMC testing and certification according to relevant standards (e.g., FCC, CE, and CISPR).
  • Texas Instruments provides antenna design guidelines and recommendations in the CC1312R74T0RGZR documentation, including PCB antenna designs, external antenna options, and antenna tuning guidelines to ensure optimal RF performance.

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CC1312R74T0RGZR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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