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CC2340R52E0RKPR - Texas Instruments

Description: RF System on a Chip - SoC SimpleLink 32-bit Arm Cortex -M0+ Bluetooth Low Energy wireless MCU with 512-kB flash

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PCB Footprints
CC2340R52E0RKPR - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RKP0040B
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3D Models
CC2340R52E0RKPR - Texas Instruments  - 3D model - Quad Flat No-Lead - RKP0040B
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CC2340R52E0RKPR Details

  • Manufacturer Part Number:

    CC2340R52E0RKPR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.50

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • JESD-30 Code:

    S-PQCC-N40

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    40

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC40,.2SQ,16

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    3.8 V

  • Supply Voltage-Min:

    1.71 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

  • uPs/uCs/Peripheral ICs Type:

    RFSOC

CC2340R52E0RKPR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout guide in the CC2340R52E0RKPR Design and Operation Guide (SWRU593) document, which includes guidelines for component placement, routing, and grounding to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The CC2340R52E0RKPR has various power modes, including shutdown, sleep, and hibernate modes. To configure the device for optimal power consumption, refer to the Power Management section in the CC2340R52E0RKPR datasheet and the CC2340R52E0RKPR Power Management Guide (SWRU592) document, which provides guidelines for configuring the device's power modes and optimizing power consumption.
  • Texas Instruments recommends using a 2.4-GHz monopole antenna or a 2.4-GHz dipole antenna with the CC2340R52E0RKPR. The CC2340R52E0RKPR Antenna Selection and Design Guide (SWRU591) document provides guidelines for selecting and designing antennas for optimal performance.
  • The CC2340R52E0RKPR supports secure boot and secure firmware updates through its TrustZone-based security architecture. Refer to the CC2340R52E0RKPR Security Guide (SWRU594) document, which provides guidelines for implementing secure boot and secure firmware updates, including cryptographic key management and secure firmware image creation.
  • The CC2340R52E0RKPR has a maximum junction temperature of 125°C. To ensure reliable operation, it is essential to implement proper thermal management, including heat sinking, thermal interface materials, and airflow management. Refer to the CC2340R52E0RKPR Thermal Design Guide (SWRU595) document for guidelines on thermal management.

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CC2340R52E0RKPR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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