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CC3100MODR11MAMOBR - Texas Instruments

Description: SimpleLink Certified Wi-Fi Network Processor, Internet-of-Things Module Solution for MCU Application

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CC3100MODR11MAMOBR - Texas Instruments PCB footprint - Other - Other - MOB
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CC3100MODR11MAMOBR Details

  • Manufacturer Part Number:

    CC3100MODR11MAMOBR

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFM-63

  • Country Of Origin:

    Mexico

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.75

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Data Rate:

    16000 Mbps

  • JESD-30 Code:

    R-PBGA-B63

  • JESD-609 Code:

    e4

  • Length:

    20.5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    63

  • Number of Transceivers:

    1

  • Operating Temperature-Max:

    70 °C

  • Operating Temperature-Min:

    -20 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.38 mm

  • Supply Current-Max:

    272 mA

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Telecom IC Type:

    WIRELESS LAN CIRCUIT

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Nickel/Gold (Ni/Au)

  • Terminal Form:

    BUTT

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    17.5 mm

CC3100MODR11MAMOBR Frequently Asked Questions (FAQs)

  • The CC3100MODR11MAMOBR module requires a well-designed antenna to achieve optimal Wi-Fi performance. TI recommends using a monopole or dipole antenna with a minimum gain of 2 dBi. The antenna should be placed at least 10 mm away from the module's edges to minimize interference.
  • To optimize power consumption, use the CC3100MODR11MAMOBR module's low-power modes, such as the 'sleep' mode, which reduces power consumption to around 10 μA. Additionally, use the module's built-in power management features, such as dynamic voltage and frequency scaling, to minimize power consumption.
  • To ensure optimal performance and minimize electromagnetic interference (EMI), TI recommends following a 4-layer PCB layout with a dedicated ground plane, and keeping the module's RF traces as short as possible. Additionally, use a common mode filter and a 10 nF capacitor to filter the power supply.
  • To implement secure Wi-Fi connectivity, use the module's built-in WPA2 encryption and implement a secure boot mechanism to prevent unauthorized access. Additionally, use secure protocols such as HTTPS and SSH to encrypt data transmission.
  • The CC3100MODR11MAMOBR module is rated for operation in the -40°C to +85°C temperature range. However, it's recommended to operate the module within the -20°C to +70°C range for optimal performance and reliability.

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CC3100MODR11MAMOBR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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