HAVING 40MHZ CRYSTAL FREQUENCY WITH +/-20PPM ACCURACY.
Bit Size:
32
DAC Channels:
NO
DMA Channels:
YES
JESD-30 Code:
S-PQCC-N64
JESD-609 Code:
e4
Length:
9 mm
Moisture Sensitivity Level:
3
Number of I/O Lines:
27
Number of Terminals:
64
On Chip Program ROM Width:
8
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-40 °C
PWM Channels:
YES
Package Body Material:
PLASTIC/EPOXY
Package Code:
HVQCCN
Package Shape:
SQUARE
Package Style:
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel):
260
RAM (bytes):
131072
ROM (words):
65536
ROM Programmability:
FLASH
Seated Height-Max:
1 mm
Speed:
80 MHz
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
INDUSTRIAL
Terminal Finish:
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form:
NO LEAD
Terminal Pitch:
0.5 mm
Terminal Position:
QUAD
Time@Peak Reflow Temperature-Max (s):
30
Width:
9 mm
uPs/uCs/Peripheral ICs Type:
RFSoC
CC3200R1M1RGC Frequently Asked Questions (FAQs)
The recommended operating temperature range for the CC3200R1M1RGC is -40°C to 85°C. However, it's essential to note that the device can operate at temperatures beyond this range, but with reduced performance and reliability.
To optimize power consumption in the CC3200R1M1RGC, use the Power Management IC (PMIC) to control the power modes, disable unnecessary peripherals, and use the low-power modes (e.g., LPDS, HIBERNATE) when the device is not in use. Additionally, optimize the Wi-Fi and MCU clock frequencies, and use the built-in power-saving features like the Wi-Fi power save mode.
The CC3200R1M1RGC has a limited current supply capability. The maximum current that can be sourced from the device's I/O pins is 4mA per pin, and the total current sourced from all I/O pins should not exceed 100mA. It's essential to ensure that the total current drawn from the device does not exceed the recommended limits to avoid overheating and damage.
To ensure reliable Wi-Fi connectivity with the CC3200R1M1RGC, use a good quality antenna, optimize the Wi-Fi settings (e.g., channel, transmission power), and implement robust Wi-Fi connection management (e.g., retry mechanisms, connection timeouts). Additionally, ensure that the device is properly configured for the target Wi-Fi network and that the firmware is up-to-date.
The CC3200R1M1RGC has several security features, including AES encryption, SHA-2 hashing, and a secure boot mechanism. It also supports WPA2 encryption for Wi-Fi connections and has a built-in random number generator for secure key generation. Additionally, the device has a secure storage area for storing sensitive data, such as encryption keys and certificates.
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System Verified
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CC3200R1M1RGC Overview
Use the download button to access the CC3200R1M1RGC schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like CC320,
or try a keyword search, such as Other uPs/uCs/Peripheral ICs
About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
