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CC45SL3AD330JYGNA - TDK

Description: Disc Type Capacitors with Lead (High Voltage Ceramic Capacitors), Capacitance=33pF, DxT: 5.5x5mm ,F: 5mm

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PCB Footprints
CC45SL3AD330JYGNA - TDK PCB footprint - Other - Other - CC45SL3AD330JYGNA
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CC45SL3AD330JYGNA - TDK  - 3D model - Other - CC45SL3AD330JYGNA
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CC45SL3AD330JYGNA Details

  • Manufacturer Part Number:

    CC45SL3AD330JYGNA

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    RADIAL LEADED

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.23.00.60

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.04

  • Capacitance:

    0.000033 µF

  • Capacitor Type:

    CERAMIC CAPACITOR

  • Dielectric Material:

    CERAMIC

  • Height:

    5.5 mm

  • JESD-609 Code:

    e3

  • Length:

    5.5 mm

  • Mounting Feature:

    THROUGH HOLE MOUNT

  • Multilayer:

    No

  • Negative Tolerance:

    5%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -25 °C

  • Package Shape:

    DISK PACKAGE

  • Package Style:

    Radial

  • Packing Method:

    BULK

  • Positive Tolerance:

    5%

  • Rated (DC) Voltage (URdc):

    1000 V

  • Surface Mount:

    NO

  • Temperature Characteristics Code:

    SL

  • Temperature Coefficient:

    -1000/+350ppm/Cel ppm/°C

  • Terminal Finish:

    TIN OVER NICKEL

  • Terminal Pitch:

    5 mm

  • Terminal Shape:

    WIRE

  • Width:

    5 mm

CC45SL3AD330JYGNA Frequently Asked Questions (FAQs)

  • The recommended land pattern for CC45SL3AD330JYGNA can be found in the TDK Corporation's recommended footprint document or by contacting their technical support. The land pattern should ensure a secure and reliable connection to the PCB.
  • CC45SL3AD330JYGNA is a moisture-sensitive device. It's essential to follow the recommended storage and handling procedures to prevent moisture absorption. This includes storing the components in a dry environment, using desiccant packaging, and baking the components before reflow soldering if they have been exposed to moisture.
  • The maximum reflow temperature for CC45SL3AD330JYGNA is 260°C. Exceeding this temperature can cause damage to the component. It's essential to follow the recommended reflow profile to ensure a reliable solder joint.
  • CC45SL3AD330JYGNA is designed to withstand moderate vibration. However, if the application involves extreme vibration, it's recommended to consult with TDK Corporation's technical support to determine the component's suitability. Additional testing or customization may be required to ensure reliability.
  • To troubleshoot issues with CC45SL3AD330JYGNA, start by reviewing the datasheet and application notes. Check for proper component orientation, soldering, and PCB design. If the issue persists, contact TDK Corporation's technical support for further assistance and guidance.

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CC45SL3AD330JYGNA Overview

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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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