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CD4050BNSR - Texas Instruments

Description: Texas Instruments CD4050BNSR, Hex Buffer, Converter, TTL, Non-Inverting, -0.5 → 20 V, 16-Pin SOIC

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CD4050BNSR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - CD4050BNSR
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CD4050BNSR - Texas Instruments  - 3D model - Small Outline Packages - CD4050BNSR
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CD4050BNSR Details

  • Manufacturer Part Number:

    CD4050BNSR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    16

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Family:

    4000/14000/40000

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    10.2 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUFFER

  • Max I(ol):

    0.018 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    6

  • Number of Inputs:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.12 mA

  • Prop. Delay@Nom-Sup:

    140 ns

  • Propagation Delay (tpd):

    140 ns

  • Qualification Status:

    Not Qualified

  • Schmitt Trigger:

    NO

  • Seated Height-Max:

    2 mm

  • Supply Voltage-Max (Vsup):

    18 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    10 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5.3 mm

CD4050BNSR Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the CD4050BNSR is typically around 10 MHz, but it can vary depending on the specific application and operating conditions.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal management practices, such as providing adequate heat sinking and ensuring good airflow around the device. Additionally, consider using a thermally-enhanced package or a device with a higher temperature rating.
  • The recommended power-on sequence for the CD4050BNSR is to apply the power supply voltage (VCC) before applying the input signals. This helps prevent unwanted output states during power-up.
  • To minimize EMI and EMC issues, use proper PCB layout techniques, such as separating analog and digital circuits, using ground planes, and adding decoupling capacitors. Additionally, consider using EMI filters or shielding to reduce electromagnetic radiation.
  • For optimal performance, follow good PCB layout practices, such as keeping signal traces short and direct, avoiding sharp corners, and using a solid ground plane. Additionally, consider using a 4-layer PCB with a dedicated power plane and a dedicated ground plane.

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CD4050BNSR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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