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CDC7005ZVAT - Texas Instruments

Description: High Performance, Low Phase Noise, Low Skew Clock Synchronizer that Synchronizes Ref Clock to VCXO

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PCB Footprints
CDC7005ZVAT - Texas Instruments PCB footprint - BGA - BGA - ZVA (S-PBGA-N64)
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3D Models
CDC7005ZVAT - Texas Instruments  - 3D model - BGA - ZVA (S-PBGA-N64)
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CDC7005ZVAT Details

  • Manufacturer Part Number:

    CDC7005ZVAT

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Package Description:

    BGA-64

  • Pin Count:

    64

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    INTEGRATED LOW-NOISE OP AMP

  • Family:

    7005

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    S-PBGA-B64

  • JESD-609 Code:

    e1

  • Length:

    8 mm

  • Logic IC Type:

    PLL BASED CLOCK DRIVER

  • Max I(ol):

    0.006 A

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    64

  • Number of True Outputs:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    265 mA

  • Prop. Delay@Nom-Sup:

    0.95 ns

  • Propagation Delay (tpd):

    0.95 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.06 ns

  • Seated Height-Max:

    1.4 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    8 mm

  • fmax-Min:

    800 MHz

CDC7005ZVAT Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VCC first, followed by VDD, and then the clock signal. This ensures proper initialization and prevents potential latch-up conditions.
  • When using the CDC7005ZVAT in a system with multiple clock domains, it's essential to ensure that the clock signal is properly synchronized and buffered to prevent clock domain crossing issues. Use a clock buffer or a clock domain crossing circuit to synchronize the clock signal.
  • The maximum frequency of operation for the CDC7005ZVAT is 700 MHz. However, the actual operating frequency may be limited by the system's clock signal quality, PCB layout, and other factors.
  • To optimize the PCB layout, follow Texas Instruments' recommended layout guidelines, including using a solid ground plane, minimizing trace lengths, and using controlled impedance traces. Additionally, place the CDC7005ZVAT close to the clock source and use a clock tree architecture to reduce signal degradation.
  • The recommended termination scheme for the CDC7005ZVAT's output signals is to use a series termination resistor (Rs) of 50-75 ohms, followed by a parallel termination capacitor (Cp) of 1-2 pF. This helps to reduce signal reflections and improve signal integrity.

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CDC7005ZVAT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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