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CDCLVC1106PW - Texas Instruments

Description: Low Jitter, 1:6 LVCMOS Fan-out Clock Buffer

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PCB Footprints
CDCLVC1106PW - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PW (R-PDSO-G14)
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3D Models
CDCLVC1106PW - Texas Instruments  - 3D model - Small Outline Packages - PW (R-PDSO-G14)
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CDCLVC1106PW Details

  • Manufacturer Part Number:

    CDCLVC1106PW

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    SOIC-14

  • Pin Count:

    14

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Family:

    CDC

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Max I(ol):

    0.012 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Number of True Outputs:

    1

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Prop. Delay@Nom-Sup:

    2 ns

  • Propagation Delay (tpd):

    2.6 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.05 ns

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    2.7 V

  • Supply Voltage-Min (Vsup):

    2.3 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

  • fmax-Min:

    250 MHz

CDCLVC1106PW Frequently Asked Questions (FAQs)

  • A good PCB layout for the CDCLVC1106PW involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, it's recommended to use a low-ESR capacitor for the VCC pin and to avoid routing signals under the device.
  • The CDCLVC1106PW requires a single 1.8V to 3.3V power supply. It's recommended to power the device with a low-noise, low-dropout regulator. Power sequencing is not critical, but it's recommended to power the device after the input signals are stable.
  • The CDCLVC1106PW can operate up to 200 MHz. As the frequency of operation increases, so does the power consumption. However, the device is designed to minimize power consumption while maintaining high-speed performance.
  • The CDCLVC1106PW has a maximum junction temperature of 150°C. To manage thermal performance, ensure good airflow, use a heat sink if necessary, and avoid blocking the thermal pad on the bottom of the package. The device is designed to operate within a specified thermal range, and exceeding this range may affect reliability.
  • The CDCLVC1106PW has built-in ESD protection diodes on all pins, which can withstand up to 2 kV of ESD. To prevent latch-up, ensure that the device is powered correctly, and avoid applying voltages that exceed the maximum ratings.

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CDCLVC1106PW Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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