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CDCLVC1310RHBR - Texas Instruments

Description: Universal input, 10 output low impedance LVCMOS Buffer

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PCB Footprints
CDCLVC1310RHBR - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - CDCLVC1310RHBR
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3D Models
CDCLVC1310RHBR - Texas Instruments  - 3D model - Quad Flat No-Lead - CDCLVC1310RHBR
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CDCLVC1310RHBR Details

  • Manufacturer Part Number:

    CDCLVC1310RHBR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    VQFN-32

  • Pin Count:

    32

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    ALSO OPERATES IN 3.3 V

  • Family:

    CDC

  • Input Conditioning:

    DIFFERENTIAL MUX

  • JESD-30 Code:

    S-PQCC-N32

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Max I(ol):

    0.024 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Number of True Outputs:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.05 ns

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    2.625 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

  • fmax-Min:

    200 MHz

CDCLVC1310RHBR Frequently Asked Questions (FAQs)

  • A good PCB layout for the CDCLVC1310RHBR involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, it's recommended to use a low-ESR capacitor for the VCC pin and to avoid routing high-speed signals near the device.
  • The CDCLVC1310RHBR requires a single 3.3V power supply, and it's recommended to use a low-dropout regulator (LDO) to ensure a clean power supply. The power sequencing requirement is to power up the VCC pin before the input signals, and to power down the VCC pin after the input signals.
  • The maximum frequency of operation for the CDCLVC1310RHBR is 1.3 GHz. As the frequency of operation increases, the power consumption also increases. It's recommended to operate the device at the lowest frequency necessary for the application to minimize power consumption.
  • The CDCLVC1310RHBR has a maximum junction temperature of 150°C. To handle thermal management, it's recommended to use a heat sink or a thermal pad, and to ensure good airflow around the device. The device should be operated within the recommended operating temperature range to ensure reliability and performance.
  • The CDCLVC1310RHBR has built-in ESD protection, but it's still recommended to use external ESD protection devices, such as TVS diodes, to protect the device from electrostatic discharge. To prevent latch-up, it's recommended to use a latch-up prevention circuit, such as a diode and resistor in series, on the input signals.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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