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CDCS501PW - Texas Instruments

Description: Part of a Family of Easy to use Clock • Consumer and Industrial Applications Generator Devices With Optional SSC Requiring EMI Reduction through Spread Spectrum Clocking • SSC Capable Clock Generator / Buffer • SSC Controllable via 3 External Pins – ±0% to ±1.5% Center Spread • 1 External Control Pin for SSC ON / OFF Selection • 40 MHz to 108 MHz Single-Ended LVCMOS Input • Single 3.3V Device Power Supply • Wide Temperature Range – 40°C to 85°C • Low Space Consumption by 8 Pin TSSOP Package

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CDCS501PW - Texas Instruments - PCB symbol
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PCB Footprints
CDCS501PW - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PW0008A
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3D Models
CDCS501PW - Texas Instruments - 3D model - Small Outline Packages - PW0008A
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CDCS501PW Details

  • Manufacturer Part Number:

    CDCS501PW

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    TSSOP-8

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Family:

    501

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.4 mm

  • Logic IC Type:

    PLL BASED CLOCK DRIVER

  • Max I(ol):

    0.012 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of True Outputs:

    1

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

  • fmax-Min:

    108 MHz

CDCS501PW Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the CDCS501PW datasheet, which includes guidelines for component placement, routing, and thermal management. It's essential to follow these guidelines to ensure optimal performance, low noise, and high accuracy.
  • The output capacitor value depends on the specific application, output voltage, and desired ripple voltage. A general rule of thumb is to use a capacitor with a value between 10uF to 47uF, with a voltage rating at least 1.5 times the output voltage. Consult the datasheet and application notes for more detailed guidance.
  • The CDCS501PW has an absolute maximum input voltage rating of 6.5V. Exceeding this voltage can cause damage to the device. It's essential to ensure that the input voltage remains within the recommended operating range of 2.7V to 5.5V.
  • The CDCS501PW does not have built-in overvoltage protection. To implement OVP, you can use an external voltage supervisor or a dedicated OVP IC. These devices can detect overvoltage conditions and shut down the CDCS501PW to prevent damage.
  • The thermal derating curve for the CDCS501PW is provided in the datasheet. It shows the maximum power dissipation allowed at different ambient temperatures. It's essential to consider thermal derating to ensure the device operates within its recommended temperature range and to prevent overheating.

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CDCS501PW Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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