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CDCV850DGG - Texas Instruments

Description: CDCV850DGG, PLL Clock Driver, 48-Pin TSSOP

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CDCV850DGG - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAG
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CDCV850DGG - Texas Instruments  - 3D model - Small Outline Packages - DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAG
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CDCV850DGG Details

  • Manufacturer Part Number:

    CDCV850DGG

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-48

  • Pin Count:

    48

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Family:

    850

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    R-PDSO-G48

  • JESD-609 Code:

    e4

  • Length:

    12.5 mm

  • Logic IC Type:

    PLL BASED CLOCK DRIVER

  • Max I(ol):

    0.012 A

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Number of True Outputs:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP48,.3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Propagation Delay (tpd):

    4 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.075 ns

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    2.7 V

  • Supply Voltage-Min (Vsup):

    2.3 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.1 mm

  • fmax-Min:

    140 MHz

CDCV850DGG Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VCC first, followed by VDD, and then the clock signal. This ensures proper initialization and prevents damage to the device.
  • When using the CDCV850DGG in a system with multiple clock domains, it's essential to ensure that the clock signal is properly synchronized and buffered to prevent clock domain crossing issues. Use a clock buffer or a clock domain crossing circuit to synchronize the clock signal.
  • The maximum frequency of operation for the CDCV850DGG is 850 MHz. However, the actual operating frequency may be limited by the system's clock distribution, signal integrity, and other factors.
  • To optimize the CDCV850DGG for low power consumption, use the lowest possible voltage supply, reduce the clock frequency, and use the power-down mode when not in use. Additionally, consider using a low-power clock source and optimizing the system's clock distribution.
  • The CDCV850DGG has a maximum junction temperature of 150°C. Ensure proper thermal management by providing adequate heat sinking, using a thermal interface material, and keeping the device away from heat sources.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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