CDRH104RNP-7R0NC footprint, schematic symbol and 3D model by Sumida

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CDRH104RNP-7R0NC Details

The recommended PCB land pattern for the CDRH104RNP-7R0NC can be found in the Sumida Corporation's application note or by contacting their technical support. A general guideline is to use a land pattern with a minimum of 1.5 mm x 1.5 mm pad size and a 0.5 mm spacing between pads.
The CDRH104RNP-7R0NC has a maximum operating temperature of 125°C. Ensure good airflow around the component, and consider using thermal vias or thermal pads to dissipate heat. Also, follow proper PCB design guidelines for thermal management.
The recommended soldering profile for the CDRH104RNP-7R0NC is a peak temperature of 260°C for 10-30 seconds. However, it's recommended to consult the Sumida Corporation's application note or technical support for specific soldering profile guidelines.
The CDRH104RNP-7R0NC is designed to withstand moderate vibration. However, for high-vibration environments, it's recommended to consult with Sumida Corporation's technical support to determine the suitability of the component for your specific application.
The CDRH104RNP-7R0NC meets various safety and regulatory standards, including UL, EN, and IEC. However, it's recommended to consult with Sumida Corporation's technical support and your application's specific regulatory requirements to ensure compliance.

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Use the download button to access the CDRH104RNP-7R0NC schematic symbol, PCB footprint, and 3D model.

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