Please enter a minimum 3 letters or numbers
Technical Content
Part Image

CDSW3004-HF - Comchip Technology

Description: Diodes - General Purpose, Power, Switching SWITCHING DIODE 225MA 350V 0201 HF

Download CDSW3004-HF Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Send part feedback
Symbol
CDSW3004-HF - Comchip Technology - PCB symbol
click to zoom
PCB Footprints
CDSW3004-HF - Comchip Technology PCB footprint - Small Outline Diode - Small Outline Diode - SOD-123_2022
click to zoom
3D Models
CDSW3004-HF - Comchip Technology - 3D model - Small Outline Diode - SOD-123_2022
click to zoom

CDSW3004-HF Details

  • Manufacturer Part Number:

    CDSW3004-HF

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Manufacturer:

    Comchip Technology Corporation Ltd

  • YTEOL:

    6.12

  • Application:

    GENERAL PURPOSE

  • Case Connection:

    UNSPECIFIED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    1 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    0.225 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.4 W

  • Rep Pk Reverse Voltage-Max:

    350 V

  • Reverse Recovery Time-Max:

    0.05 µs

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

CDSW3004-HF Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the high-frequency traces short and away from the power plane.
  • Use a thermally conductive material for the PCB substrate, and ensure good thermal contact between the device and the heat sink. Avoid thermal gradients and hot spots.
  • Exceeding the maximum junction temperature can lead to reduced lifespan, increased thermal resistance, and potentially catastrophic failure. Ensure proper heat sinking and thermal management.
  • Yes, the CDSW3004-HF is suitable for switching power supply applications. However, ensure proper snubber design and layout to minimize electromagnetic interference (EMI).
  • Use ESD-sensitive handling procedures, and consider adding external ESD protection devices, such as TVS diodes, to prevent damage during handling and assembly.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

CDSW3004-HF Overview

Use the download button to access the CDSW3004-HF schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like CDSW3, or try a keyword search, such as Rectifier Diodes

Parts related to CDSW3004-HF

Showing 0 results

Part Image

← Prev Next →
About Us Contact Us Terms of Service Do not sell or share my personal information Privacy Policy Digital Services Act Library Loader Twitter LinkedIn

All content Copyright © 2020, Supplyframe.com. All rights reserved. Back to top ↑