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CEC1736-S0-I/2ZW - Microchip

Description: • AES256 • SHA-384 • ECDSA • True Random Number Generator (SP800-90B) • SPI Boot Flash Monitoring and Intervention (1.8V or 3.3V) • Key Management Engine • Hardware-Based Physically Unclonable Function (PUF) • Differential Power Analysis Countermeasures • User Configurable 3.3V or 1.8V Power Spec • Internal Q-Switches • Lifecycle Management • 84-pin and 64-pin Package Sizes (7x7x0.8 mm and 5.5x5.5x0.92 mm)

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PCB Footprints
CEC1736-S0-I/2ZW - Microchip PCB footprint - BGA - BGA - 84 pin WFBGA(2)), 7mm x 7mm body, 0.65
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3D Models
CEC1736-S0-I/2ZW - Microchip  - 3D model - BGA - 84 pin WFBGA(2)), 7mm x 7mm body, 0.65
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CEC1736-S0-I/2ZW Details

  • Manufacturer Part Number:

    CEC1736-S0-I/2ZW

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    WFBGA-84

  • Pin Count:

    84

  • Manufacturer Package Code:

    WFBGA-84

  • Country Of Origin:

    Mainland China, Taiwan

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Microchip Technology Inc

  • JESD-30 Code:

    S-PBGA-B84

  • Length:

    7 mm

  • Number of Terminals:

    84

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA84,10X10,25

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    BOTTOM

  • Width:

    7 mm

  • uPs/uCs/Peripheral ICs Type:

    CRYPTOGRAPHIC AUTHENTICATOR

CEC1736-S0-I/2ZW Frequently Asked Questions (FAQs)

  • Microchip provides a recommended PCB layout and thermal management guidelines in their application notes and design guides. It's essential to follow these guidelines to ensure optimal performance, thermal dissipation, and signal integrity. Additionally, consider using thermal vias, heat sinks, and thermal interface materials to maintain a safe operating temperature.
  • Microchip provides a secure boot mechanism and firmware update guidelines in their documentation. Implementing secure boot involves generating and storing secure keys, configuring the boot process, and using cryptographic algorithms. For firmware updates, use a secure communication protocol, such as SSL/TLS, and ensure that the update process is authenticated and validated.
  • The CEC1736-S0-I/2ZW has specific power sequencing and voltage ramp-up requirements to ensure proper operation and prevent damage. Refer to the datasheet and application notes for the recommended power-up sequence, voltage ramp-up rates, and power supply decoupling guidelines.
  • Optimizing performance and power consumption involves understanding the device's power modes, clock frequencies, and peripheral usage. Use Microchip's power estimation and optimization tools, such as the Power Calculator, to determine the optimal configuration for your application. Additionally, consider using power-saving techniques, such as dynamic voltage and frequency scaling, and peripheral gating.
  • To ensure EMC and EMI compliance, follow Microchip's guidelines for PCB layout, component selection, and shielding. Use EMI filters, chokes, and capacitors to reduce emissions and susceptibility. Additionally, consider using a metal shield or enclosure to contain emissions and provide a solid grounding point.

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CEC1736-S0-I/2ZW Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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