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CES520,L3F - Toshiba

Description: Schottky Diodes & Rectifiers SM Sig Schotky Diode 30 VR 0.2A 1 Circuit

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PCB Footprints
CES520,L3F - Toshiba PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD-523
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3D Models
CES520,L3F - Toshiba  - 3D model - Small Outline Diode Flat Lead - SOD-523
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CES520,L3F Details

  • Manufacturer Part Number:

    CES520,L3F

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    6

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.6 V

  • JESD-30 Code:

    R-PDSO-F2

  • Non-rep Pk Forward Current-Max:

    1 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power Dissipation-Max:

    0.15 W

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    30 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

CES520,L3F Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the IC, and a 2-layer or 4-layer PCB with a solid ground plane is suggested to reduce thermal resistance and improve heat dissipation.
  • Implement a heat sink or thermal management system, and ensure good airflow around the device. Also, consider derating the device's power dissipation according to the ambient temperature.
  • A 10uF to 22uF X5R or X7R ceramic capacitor is recommended for input decoupling, placed as close to the IC as possible.
  • Use a shielded enclosure, keep the PCB layout compact, and use a common-mode choke or ferrite bead on the input lines to reduce EMI emissions.
  • The input voltage deviation should be within ±10% of the nominal input voltage to ensure reliable operation and prevent damage to the device.

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