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CFB750-300S48 - Cincon

Description: 750 WATT 2:1 INPUT DC-DC CONVERTERS

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PCB Footprints
CFB750-300S48 - Cincon PCB footprint - Other - Other - CFB750-300S48
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CFB750-300S48 - Cincon  - 3D model - Other - CFB750-300S48
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CFB750-300S48 Details

  • Manufacturer Part Number:

    CFB750-300S48

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FULL BRICK PACKAGE-16

  • ECCN Code:

    EAR99

  • Manufacturer:

    Cincon Electronics Corporation

  • YTEOL:

    9

  • Analog IC - Other Type:

    DC-DC REGULATED POWER SUPPLY MODULE

  • Approvals:

    IEC, EN, UL

  • Efficiency (Main Output):

    91%

  • Input Voltage-Max:

    425 V

  • Input Voltage-Min:

    200 V

  • Input Voltage-Nom:

    300 V

  • JESD-30 Code:

    R-PXMA-P16

  • Length:

    116.8 mm

  • Line Regulation-Max:

    0.2%

  • Load Regulation-Max:

    0.5%

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    15.6 A

  • Output Voltage-Max:

    52.8 V

  • Output Voltage-Min:

    28.8 V

  • Output Voltage-Nom:

    48 V

  • Package Body Material:

    PLASTIC

  • Package Code:

    XMA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Protections:

    OVER CURRENT, OVER VOLTAGE, SHORT CIRCUIT

  • Ripple Voltage (Main Out):

    0.35 Vrms

  • Screening Level:

    IEC/EN/UL 62368-1

  • Seated Height-Max:

    13.2 mm

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Terminal Form:

    PIN/PEG

  • Terminal Position:

    UNSPECIFIED

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Total Power Output-Max:

    750 W

  • Trim/Adjustable Output:

    YES

  • Width:

    61 mm

CFB750-300S48 Frequently Asked Questions (FAQs)

  • The recommended PCB layout should ensure good thermal conductivity and minimal thermal resistance. A multi-layer PCB with thermal vias and a heat sink on the top and bottom sides of the module can help to dissipate heat effectively. Additionally, a thermal interface material (TIM) can be used to improve heat transfer between the module and the heat sink.
  • To ensure reliable and efficient power transmission, it is essential to follow proper wiring and cabling practices, such as using twisted pairs, shielding, and proper termination. Additionally, the power supply should be designed to provide a stable output voltage and current, and the system should be protected against overvoltage, undervoltage, and overcurrent conditions.
  • The CFB750-300S48 is designed to meet various safety standards and certifications, including UL, CE, and RoHS. However, it is essential to ensure that the final application meets the relevant safety standards and regulations, such as IEC 62368-1, IEC 60950-1, and others. Additionally, proper safety precautions should be taken during handling, installation, and operation of the module.
  • To troubleshoot common issues with the CFB750-300S48, it is essential to follow a systematic approach, including checking the input voltage, output voltage, and current, as well as monitoring the temperature and output ripple. Additionally, the module's datasheet and application notes should be consulted, and the manufacturer's technical support should be contacted if necessary.
  • The CFB750-300S48 is designed to operate in a wide range of environmental and operating conditions, including temperatures from -40°C to 85°C, humidity up to 95%, and vibration up to 10G. However, it is essential to consult the datasheet and application notes for specific details on the recommended operating conditions and any necessary derating or precautions.

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CFB750-300S48 Overview

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