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CFRM104-HF - Comchip Technology

Description: CFRM104-HF

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CFRM104-HF - Comchip Technology PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - Mini SMA
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CFRM104-HF - Comchip Technology  - 3D model - Small Outline Diode Flat Lead - Mini SMA
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CFRM104-HF Details

  • Manufacturer Part Number:

    CFRM104-HF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    SOD-123, SMA, 2 PIN

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Comchip Technology Corporation Ltd

  • YTEOL:

    3

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.3 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    400 V

  • Reverse Recovery Time-Max:

    0.15 µs

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

CFRM104-HF Frequently Asked Questions (FAQs)

  • The recommended land pattern for CFRM104-HF is a rectangular pad with a size of 2.5mm x 1.25mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • To handle thermal considerations for CFRM104-HF, ensure good thermal conduction by using a thermal pad or a heat sink. The thermal pad should be connected to a copper plane or a heat sink to dissipate heat efficiently. Additionally, ensure good airflow around the component to prevent overheating.
  • The recommended soldering profile for CFRM104-HF is a reflow soldering process with a peak temperature of 240°C to 250°C, and a dwell time of 30 seconds to 60 seconds. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.
  • To ensure the reliability of CFRM104-HF in high-vibration environments, use a robust mounting method such as screwing or adhesive bonding. Additionally, ensure that the component is properly secured to the PCB and that the PCB is designed to withstand vibrations.
  • To ensure ESD protection for CFRM104-HF, handle the component in an ESD-protected environment, and use ESD-protective packaging and storage. During assembly, use ESD-protective wrist straps and mats, and ensure that the PCB is designed with ESD protection in mind.

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CFRM104-HF Overview

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