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CI160808-33NJ - Bourns

Description: Fixed Inductors 33nH 5% MultiLayer High Frequency

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Symbol
CI160808-33NJ - Bourns - PCB symbol
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PCB Footprints
CI160808-33NJ - Bourns PCB footprint - Inductors Chip - Inductors Chip - 1.6mmx0.8mm
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3D Models
CI160808-33NJ - Bourns - 3D model - Inductors Chip - 1.6mmx0.8mm
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CI160808-33NJ Details

  • Manufacturer Part Number:

    CI160808-33NJ

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    CHIP

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    3

  • Case/Size Code:

    0603

  • Construction:

    Rectangular

  • Core Material:

    CERAMIC

  • DC Resistance:

    0.55 Ω

  • Inductance-Nom (L):

    0.033 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.8 mm

  • Package Length:

    1.6 mm

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, Embossed, 7 Inch

  • Quality Factor-Min (at L-nom):

    12

  • Rated Current-Max:

    0.3 A

  • Self Resonance Frequency:

    1200 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    100 MHz

  • Tolerance:

    5%

CI160808-33NJ Frequently Asked Questions (FAQs)

  • A symmetrical layout with a solid ground plane and minimal signal trace length is recommended. Keep the input and output traces separate and avoid crossing them to minimize crosstalk.
  • Ensure good airflow around the device, avoid overheating nearby components, and consider using a heat sink if the device is expected to operate in high-temperature environments.
  • Power up the input voltage (VIN) before applying the enable signal (EN). This ensures the internal circuitry is properly biased before the device is enabled.
  • Check the input voltage, enable signal, and output voltage for correct operation. Verify the PCB layout and component placement for any potential issues. Consult the datasheet and application notes for troubleshooting guides.
  • Yes, but ensure you follow the recommended design and manufacturing guidelines, and consult with Bourns Inc. for specific requirements and certifications (e.g., AEC-Q100, ISO 26262).

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CI160808-33NJ Overview

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