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CIG22B4R7MNE - SAMSUNG

Description: FIXED IND 4.7UH 1A 250 MOHM SMD

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PCB Footprints
CIG22B4R7MNE - SAMSUNG PCB footprint - Inductors Chip - Inductors Chip - CIG22H2R2MNE
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3D Models
CIG22B4R7MNE - SAMSUNG  - 3D model - Inductors Chip - CIG22H2R2MNE
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CIG22B4R7MNE Details

  • Manufacturer Part Number:

    CIG22B4R7MNE

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Manufacturer:

    Samsung Electro-Mechanics

  • YTEOL:

    0

  • Case/Size Code:

    1008

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.25 Ω

  • Inductance-Nom (L):

    4.7 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    1 mm

  • Package Length:

    2.5 mm

  • Package Style:

    SMT

  • Package Width:

    2 mm

  • Packing Method:

    TR, Embossed, 7 Inch

  • Rated Current-Max:

    1 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Special Feature:

    DCR MEASURED AT 20% TOLERANCE

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    1 MHz

  • Tolerance:

    20%

CIG22B4R7MNE Frequently Asked Questions (FAQs)

  • The recommended soldering temperature profile is 250°C for 3-5 seconds, with a peak temperature of 260°C for 1-2 seconds.
  • The CIG22B4R7MNE is designed to handle high-frequency noise up to 1 GHz, making it suitable for high-speed applications.
  • Yes, the CIG22B4R7MNE is compatible with lead-free soldering, making it suitable for RoHS-compliant designs.
  • The maximum operating temperature range for the CIG22B4R7MNE is -55°C to 125°C, making it suitable for a wide range of applications.
  • Yes, the CIG22B4R7MNE is designed for high-reliability applications, with a failure rate of < 1% per 1,000 hours at 125°C.

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