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CIGT201208EH1R0MNE - SAMSUNG

Description: FIXED IND 1UH 3.1A 55 MOHM SMD

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CIGT201208EH1R0MNE - SAMSUNG  - 3D model
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CIGT201208EH1R0MNE Details

  • Manufacturer Part Number:

    CIGT201208EH1R0MNE

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP, 0805

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Samsung Electro-Mechanics

  • YTEOL:

    6

  • Core Material:

    METAL COMPOSITE

  • DC Resistance:

    0.055 Ω

  • Inductance-Nom (L):

    1 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Rated Current-Max:

    3.1 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN OVER NICKEL

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    1 MHz

  • Tolerance:

    20%

CIGT201208EH1R0MNE Frequently Asked Questions (FAQs)

  • The recommended soldering temperature profile for the CIGT201208EH1R0MNE is a peak temperature of 260°C for 10-30 seconds, with a ramp-up rate of 3°C/s and a ramp-down rate of 6°C/s.
  • Yes, the CIGT201208EH1R0MNE is designed to withstand high-vibration environments, with a vibration endurance of 10-2000 Hz, 1.5 mm amplitude, and 3 axes.
  • The CIGT201208EH1R0MNE has an MSL rating of 3, which means it can withstand exposure to moisture for up to 168 hours at 30°C and 60% relative humidity.
  • Yes, the CIGT201208EH1R0MNE is AEC-Q200 qualified, which means it meets the stringent requirements for use in automotive applications.
  • The ESR of the CIGT201208EH1R0MNE is typically around 10-20 mΩ at 100 kHz, but this value can vary depending on the frequency and operating conditions.

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CIGT201208EH1R0MNE Overview

Use the download button to access the CIGT201208EH1R0MNE 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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