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CL10B103KC8WPNC - SAMSUNG

Description: Multilayer Ceramic Capacitors MLCC - SMD/SMT

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PCB Footprints
CL10B103KC8WPNC - SAMSUNG PCB footprint - Capacitor Chip Non-polarised - Capacitor Chip Non-polarised - CL10 (0.9T)
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CL10B103KC8WPNC - SAMSUNG  - 3D model - Capacitor Chip Non-polarised - CL10 (0.9T)
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CL10B103KC8WPNC Details

  • Manufacturer Part Number:

    CL10B103KC8WPNC

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Philippines, South Korea

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.24.00.20

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Samsung Electro-Mechanics

  • YTEOL:

    7

  • Capacitance:

    0.01 µF

  • Capacitor Type:

    CERAMIC CAPACITOR

  • Dielectric Material:

    CERAMIC

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Multilayer:

    Yes

  • Negative Tolerance:

    10%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Shape:

    RECTANGULAR PACKAGE

  • Packing Method:

    TR, CARDBOARD, 7 INCH

  • Positive Tolerance:

    10%

  • Rated (DC) Voltage (URdc):

    100 V

  • Reference Standard:

    AEC-Q200

  • Size Code:

    0603

  • Surface Mount:

    YES

  • Temperature Characteristics Code:

    X7R

  • Temperature Coefficient:

    15% ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

CL10B103KC8WPNC Frequently Asked Questions (FAQs)

  • The recommended soldering temperature is 260°C for 10 seconds or less, to prevent damage to the capacitor.
  • Yes, the CL10B103KC8WPNC is suitable for high-frequency applications up to 1 GHz due to its low equivalent series resistance (ESR) and high self-resonant frequency.
  • The CL10B103KC8WPNC is rated for operation up to 125°C, but its capacitance value may decrease by up to 20% at high temperatures. Consult the datasheet for detailed temperature characteristics.
  • Yes, the CL10B103KC8WPNC is compatible with lead-free soldering processes and meets the requirements of the RoHS directive.
  • The recommended land pattern for the CL10B103KC8WPNC is a rectangular pad with a size of 1.6 mm x 0.8 mm, with a solder mask opening of 1.2 mm x 0.6 mm.

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CL10B103KC8WPNC Overview

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Part Image C0603C103K1RAC90283325 KEMET Corporation

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Part Image CL10B103KC85PNF Samsung Electro-Mechanics

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Part Image ERC0603X7R103K100C KEMET Corporation

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For a full list of alternate parts for CL10B103KC8WPNC, check out Findchips.com