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CL31B335KOHNNNE - SAMSUNG

Description: ormal MLCC temporarily charges and reduces noise in electronic circuits, and is the most broadly available chip-type capacitor. The product line allows realization of various sizes and a wide range of capacitance. It also has the structural capacity to mount chips on a PCB at a high speed.

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PCB Footprints
CL31B335KOHNNNE - SAMSUNG PCB footprint - Capacitor Chip Non-polarised - Capacitor Chip Non-polarised - 1206/3216.
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3D Models
CL31B335KOHNNNE - SAMSUNG  - 3D model - Capacitor Chip Non-polarised - 1206/3216.
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CL31B335KOHNNNE Details

  • Manufacturer Part Number:

    CL31B335KOHNNNE

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    1206

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Philippines, South Korea

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.24.00.20

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Samsung Electro-Mechanics

  • YTEOL:

    6

  • Capacitance:

    3.3 µF

  • Capacitor Type:

    CERAMIC CAPACITOR

  • Dielectric Material:

    CERAMIC

  • Height:

    1.6 mm

  • JESD-609 Code:

    e3

  • Length:

    3.2 mm

  • Mounting Feature:

    SURFACE MOUNT

  • Multilayer:

    Yes

  • Negative Tolerance:

    10%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Packing Method:

    TR, EMBOSSED PLASTIC, 7 INCH

  • Positive Tolerance:

    10%

  • Rated (DC) Voltage (URdc):

    16 V

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Temperature Characteristics Code:

    X7R

  • Temperature Coefficient:

    15% ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Width:

    1.6 mm

CL31B335KOHNNNE Frequently Asked Questions (FAQs)

  • The recommended soldering temperature profile is 250°C for 10-30 seconds, with a peak temperature of 260°C for 5 seconds.
  • The CL31B335KOHNNNE is designed to handle high-frequency noise up to 1 GHz, making it suitable for high-speed digital circuits and RF applications.
  • Yes, the CL31B335KOHNNNE is compatible with lead-free soldering processes, making it suitable for RoHS-compliant designs.
  • The maximum operating temperature range for the CL31B335KOHNNNE is -55°C to 125°C, making it suitable for a wide range of applications.
  • The CL31B335KOHNNNE is designed to operate in high-humidity environments, with a moisture sensitivity level (MSL) of 3, making it suitable for applications in humid or wet environments.

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CL31B335KOHNNNE Overview

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CL31B335KOHNNNE Alternates

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Image Part Number Model
Part Image SH31B335K160CT Walsin Technology Corporation

Ceramic Capacitor, Multilayer, Ceramic, 16V, 10% +Tol, 10% -Tol, X7R, 15% TC, 3.3uF, Surface Mount, 1206

Part Image CL31B335KOHANNE Samsung Electro-Mechanics

Ceramic Capacitor, Multilayer, Ceramic, 16V, 10% +Tol, 10% -Tol, X7R, 15% TC, 3.3uF, Surface Mount, 1206

Part Image CL31B335KOHNCNC Samsung Electro-Mechanics

Ceramic Capacitor, Multilayer, Ceramic, 16V, 10% +Tol, 10% -Tol, X7R, 15% TC, 3.3uF, Surface Mount, 1206

Part Image CL31B335KOHNCNE Samsung Electro-Mechanics

Ceramic Capacitor, Multilayer, Ceramic, 16V, 10% +Tol, 10% -Tol, X7R, 15% TC, 3.3uF, Surface Mount, 1206

Part Image CL31B335KOHACNL Samsung Electro-Mechanics

Ceramic Capacitor, Multilayer, Ceramic, 16V, 10% +Tol, 10% -Tol, X7R, 15% TC, 3.3uF, Surface Mount, 1206

For a full list of alternate parts for CL31B335KOHNNNE, check out Findchips.com