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CL88030T-E/MF - Microchip

Description: Suitable for 120VAC/230VAC/277VAC Nominal Input Voltage - ± 15% Input voltage tolerance recommended • Targeted for 2W and Greater Output Power • Programmable Overtemperature Protection - Provides gradual reduction in light output with increasing temperature • Active Line Regulation - Provides fairly constant output power over variations in AC line voltage - Adjustable “knee” of regulation • Four Taps (CL88030) or Six Taps (CL88031) with Two Current Set Resistors - Allows optimization of THD •

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PCB Footprints
CL88030T-E/MF - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - 10-Lead Plastic Dual Flat, No Lead Package (MF) -3x30.9mm Body [DFN]
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3D Models
CL88030T-E/MF - Microchip  - 3D model - Small Outline No-lead - 10-Lead Plastic Dual Flat, No Lead Package (MF) -3x30.9mm Body [DFN]
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CL88030T-E/MF Details

  • Manufacturer Part Number:

    CL88030T-E/MF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    10

  • Manufacturer Package Code:

    DFN-10

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    20

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    S-PDSO-N10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Multiplexed Display Capability:

    NO

  • Number of Functions:

    1

  • Number of Segments:

    10

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC10,.12,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    12 V

  • Supply Voltage-Min:

    10 V

  • Supply Voltage-Nom:

    11 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    3 mm

CL88030T-E/MF Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. Ensure that the thermal pad is connected to a solid ground plane to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current limits. Use a reliable power supply, and consider using a voltage regulator to maintain a stable voltage. Also, ensure good thermal management and avoid overheating.
  • Use a shielded enclosure, and ensure that the PCB is designed with EMI and RFI mitigation in mind. Use decoupling capacitors, and consider using a common-mode choke to reduce EMI. Also, ensure that the device is operated within the recommended frequency range.
  • Use a logic analyzer or oscilloscope to monitor the device's signals. Check the power supply voltage and current, and ensure that the device is operated within the recommended specifications. Consult the datasheet and application notes for troubleshooting guidelines.
  • Use a redundant design, and ensure that the device is operated within the recommended specifications. Consider using a watchdog timer, and implement error detection and correction mechanisms. Also, ensure that the device is manufactured and tested according to high-reliability standards.

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CL88030T-E/MF Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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