A 2-layer PCB with a thermal via array underneath the device is recommended. The thermal vias should be connected to a solid copper plane on the bottom layer to dissipate heat efficiently.
Use a soldering profile with a peak temperature of 260°C (500°F) and a dwell time of 30-60 seconds. Ensure the PCB is clean and free of oxidation. Use a solder with a melting point above 217°C (423°F).
The device can withstand voltage transients up to 1.5 times the maximum rated voltage (VDRM) for a duration of 100 μs. Exceeding this may cause damage to the device.
Handle the device in an ESD-controlled environment. Use an ESD wrist strap or mat, and ensure all equipment is grounded. Avoid touching the device's pins or leads.
Store the device in a dry, cool place (below 30°C/86°F and 60% RH). Avoid exposing the device to direct sunlight, moisture, or extreme temperatures.
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CLM2D-RCC-CA0C0BB3 Overview
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