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CLP-130-02-F-DH - SAMTEC

Description: 60 Position Low Profile Dual-Wipe Socket, 0.050" Pitch, Surface Mount, Horizontal Dual-Row

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CLP-130-02-F-DH - SAMTEC PCB footprint - Other - Other - CLP-130-02-YYY-DH
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CLP-130-02-F-DH - SAMTEC  - 3D model - Other - CLP-130-02-YYY-DH
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CLP-130-02-F-DH Details

  • Manufacturer Part Number:

    CLP-130-02-F-DH

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT

  • Country Of Origin:

    Malaysia, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.69.40.40

  • Manufacturer:

    Samtec Inc

  • YTEOL:

    9.4

  • Additional Feature:

    LOW PROFILE, E.L.P.

  • Body Breadth:

    0.135 inch

  • Body Depth:

    0.12 inch

  • Body Length:

    1.517 inch

  • Body/Shell Style:

    SOCKET

  • Connector Type:

    BOARD CONNECTOR

  • Contact Finish Mating:

    GOLD FLASH OVER NICKEL (50)

  • Contact Finish Termination:

    Tin (Sn) - with Nickel (Ni) barrier

  • Contact Gender:

    FEMALE

  • Contact Material:

    PHOSPHOR BRONZE

  • Contact Pattern:

    RECTANGULAR

  • Contact Resistance:

    10 mΩ

  • Contact Style:

    SQ PIN-SKT

  • DIN Conformance:

    NO

  • Durability:

    100 Cycles

  • Filter Feature:

    NO

  • IEC Conformance:

    NO

  • Insertion Force-Max:

    1.112 N

  • Insulator Color:

    BLACK

  • Insulator Material:

    LIQUID CRYSTAL POLYMER

  • JESD-609 Code:

    e3

  • MIL Conformance:

    NO

  • Mating Contact Pitch:

    0.05 inch

  • Mating Contact Row Spacing:

    0.05 inch

  • Mating Information:

    MULTIPLE MATING PARTS AVAILABLE

  • Mixed Contacts:

    NO

  • Mounting Style:

    RIGHT ANGLE

  • Mounting Type:

    BOARD

  • Number Of Connectors:

    ONE

  • Number Of PCB Rows:

    2

  • Number of Rows Loaded:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -65 °C

  • Option:

    GENERAL PURPOSE

  • PCB Contact Pattern:

    RECTANGULAR

  • PCB Contact Row Spacing:

    3.9878 mm

  • Plating Thickness:

    FLASH inch

  • Rated Current (Signal):

    1.8 A

  • Reference Standard:

    UL

  • Terminal Pitch:

    1.27 mm

  • Termination Type:

    SURFACE MOUNT

  • Total Number of Contacts:

    60

  • Withdrawl Force-Min:

    .556 N

CLP-130-02-F-DH Frequently Asked Questions (FAQs)

  • The recommended mating sequence for the CLP-130-02-F-DH is to mate the contacts first, followed by the housing. This ensures proper alignment and prevents damage to the contacts.
  • Yes, the CLP-130-02-F-DH is designed to withstand high-vibration environments. It has a ruggedized design and is suitable for use in applications with high shock and vibration.
  • The maximum operating temperature for the CLP-130-02-F-DH is 125°C. However, it's recommended to derate the connector's current-carrying capacity at higher temperatures to ensure reliable operation.
  • Yes, the CLP-130-02-F-DH is designed to be resistant to harsh environments. It has a sealed design and is made with materials that can withstand exposure to humidity, chemicals, and other environmental stressors.
  • The CLP-130-02-F-DH has a standard mating height of 2mm, but Samtec offers variations with different mating heights and stack heights. Consult the Samtec catalog or contact their technical support for more information on custom options.

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