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CLS10F40,L3F - Toshiba

Description: SS Schottky barrier diode, High-speed switching, Low leakage current, Io:1A, VR: 40V

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Symbol
CLS10F40,L3F - Toshiba - PCB symbol
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PCB Footprints
CLS10F40,L3F - Toshiba PCB footprint - Other - Other - CL2E
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3D Models
CLS10F40,L3F - Toshiba - 3D model - Other - CL2E
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CLS10F40,L3F Details

  • Manufacturer Part Number:

    CLS10F40,L3F

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    5

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.57 V

  • JESD-30 Code:

    R-XBCC-N2

  • Non-rep Pk Forward Current-Max:

    10 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Rep Pk Reverse Voltage-Max:

    40 V

  • Reverse Current-Max:

    25 µA

  • Reverse Test Voltage:

    40 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

CLS10F40,L3F Frequently Asked Questions (FAQs)

  • The recommended land pattern for the CLS10F40,L3F is a rectangular pad with a size of 2.5mm x 1.6mm, with a solder mask opening of 2.2mm x 1.3mm.
  • The CLS10F40,L3F has a thermal pad on the bottom, which should be connected to a thermal land on the PCB. A thermal interface material (TIM) can be used to improve heat transfer. Additionally, a heat sink or a thermal management system can be used to dissipate heat.
  • The maximum operating temperature range for the CLS10F40,L3F is -40°C to 125°C, with a storage temperature range of -40°C to 150°C.
  • To ensure the reliability of the CLS10F40,L3F, it is recommended to follow proper handling and storage procedures, use a clean and dry environment, and avoid exposure to moisture and contaminants. Additionally, a burn-in test can be performed to screen out early failures.
  • The recommended soldering profile for the CLS10F40,L3F is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.

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CLS10F40,L3F Overview

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