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CLVC16244AIDGGREP - Texas Instruments

Description: Enhanced Product 16-Bit Buffer/Driver With 3-State Outputs

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CLVC16244AIDGGREP - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGG0048A
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CLVC16244AIDGGREP - Texas Instruments  - 3D model - Small Outline Packages - DGG0048A
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CLVC16244AIDGGREP Details

  • Manufacturer Part Number:

    CLVC16244AIDGGREP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Pin Count:

    48

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Control Type:

    ENABLE LOW

  • Count Direction:

    UNIDIRECTIONAL

  • Family:

    LVC/LCX/Z

  • JESD-30 Code:

    R-PDSO-G48

  • JESD-609 Code:

    e4

  • Length:

    12.5 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS DRIVER

  • Max I(ol):

    0.024 A

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    4

  • Number of Functions:

    16

  • Number of Ports:

    2

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP48,.3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.02 mA

  • Prop. Delay@Nom-Sup:

    4.1 ns

  • Propagation Delay (tpd):

    6.6 ns

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100; MIL-PRF-38535

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.1 mm

CLVC16244AIDGGREP Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good high-speed design practices, such as using a solid ground plane, minimizing trace lengths, and using 50-ohm transmission lines to ensure signal integrity.
  • The CLVC16244AIDGGREP has a thermal pad that must be connected to a solid ground plane to dissipate heat. Ensure good thermal conductivity by using a thermal interface material and a heat sink if necessary. Follow the recommended thermal design guidelines in the datasheet.
  • While the datasheet specifies a maximum clock frequency of 200 MHz, the actual operating frequency may be limited by the system's signal integrity, PCB layout, and other factors. It's essential to perform signal integrity analysis and simulation to determine the maximum operating frequency for your specific design.
  • To minimize jitter and ensure signal integrity, use a clean power supply, decouple the device properly, and use a low-jitter clock source. Additionally, follow good high-speed design practices, such as using differential signaling, minimizing trace lengths, and using 50-ohm transmission lines.
  • The recommended power-up sequence is to apply VCC first, followed by VCCIO, and then the clock signal. This ensures that the internal voltage regulators are powered up correctly and minimizes the risk of latch-up or damage to the device.

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CLVC16244AIDGGREP Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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