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Part Image

CLVC16T245MDGGEP - Texas Instruments

Description: Enhanced Product 16-Bit Dual-Supply Bus Transceiver

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PCB Footprints

CLVC16T245MDGGEP - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAG
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3D Models

CLVC16T245MDGGEP - Texas Instruments  - 3D model - Small Outline Packages - DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAG
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  • Datasheet Download Datasheet
  • Stock & Prices $ Check Stock & Prices
  • Part Number CLVC16T245MDGGEP
  • Manufacturer Texas Instruments
  • Pin Count 48
  • Part Category Integrated Circuit
  • Package Category Small Outline Packages
  • Footprint Name Small Outline Packages - DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAG
  • Released Date Jul 31, 2020
  • Pinout / Pin List Click Here (Member Only)

CLVC16T245MDGGEP Details

  • Manufacturer Part Number:

    CLVC16T245MDGGEP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP, TSSOP48,.3,20

  • Pin Count:

    48

  • Reach Compliance Code:

    compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Texas Instruments

  • Risk Rank:

    1.61

  • Control Type:

    COMMON CONTROL

  • Count Direction:

    BIDIRECTIONAL

  • Family:

    LVC/LCX/Z

  • JESD-30 Code:

    R-PDSO-G48

  • JESD-609 Code:

    e4

  • Length:

    12.5 mm

  • Load Capacitance (CL):

    15 pF

  • Logic IC Type:

    BUS TRANSCEIVER

  • Max I(ol):

    0.032 A

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    8

  • Number of Functions:

    2

  • Number of Ports:

    2

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP48,.3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power Supplies:

    3.3 V

  • Power Supply Current-Max (ICC):

    0.03 mA

  • Prop. Delay@Nom-Sup:

    10.2 ns

  • Propagation Delay (tpd):

    27.8 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Subcategory:

    Bus Driver/Transceivers

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Translation:

    1.8/5.5V&1.8/5.5V

  • Width:

    6.1 mm

Risk Rank: Design Risk

CLVC16T245MDGGEP — Texas Instruments
2.2 - Low Design Risk
Design Risk Rank is determined by in-depth analysis across multiple factors, including part availability, functional equivalents, lifecycle and more. Learn more →

Risk Rank

Risk Rank is a proprietary algorithm Supplyframe has developed to quantify component risk using multiple data points. This ranking helps engineers and buyers determine whether alternates should be sought for parts that are deemed as high risk.

Risk Rank Example

Risk Rank is determined by a combination of factors such as product lifecycle status, price & inventory volatility, current inventory availability and much more. Even the availability of manufacturer specifications, part documentation such as datasheets and reference designs have an impact on determining the overall riskiness of a part.

The risk is characterized across three product phases:

  • Design
  • Production
  • Long Term

We focus on the Design Phase on Component Search Engine in our evaluation of Risk.

Design Phase

The design phase of a product is at the beginning of the product lifecycle. This is when engineers are doing analysis of components in the marketplace, determining which specifications are most important for their design and assessing the cost impact of using this particular component. While this is early in the product lifecycle, choices at this point can severely impact a product much later on when the product is being made. Additionally, this stage is the one furthest from a product being made, which is why we focus on metrics of stability over time when determining Design Risk.

Risk Rank Breakdown

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CLVC16T245MDGGEP Overview

Use the download button to access the CLVC16T245MDGGEP schematic symbol, PCB footprint, and 3D model.
CLVC16T245MDGGEP by Texas Instruments has a score of
To find more CAD model downloads similar to this part, try a partial part number search, like CLVC1, or try a keyword search, such as Bus Driver/Transceivers

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Part Image CLVC16T245MDGGREP Texas Instruments

Enhanced Product 16-Bit Dual-Supply Bus Transceiver 48-TSSOP -55 to 125

Part Image SN74LVC16T245DGGR Texas Instruments

16-bit dual-supply bus transceiver with configurable level-shifting / voltage translation 48-TSSOP -40 to 85

Part Image SN74LVCH16T245DGGR Texas Instruments

16-Bit Dual-Supply Bus Transceiver, Configurable Voltage Translation, 3-State Outputs 48-TSSOP -40 to 85

Part Image 74LVCH16T245DGGRG4 Texas Instruments

16-Bit Dual-Supply Bus Transceiver, Configurable Voltage Translation, 3-State Outputs 48-TSSOP -40 to 85

Part Image 74LVCH16T245DGGRE4 Texas Instruments

16-Bit Dual-Supply Bus Transceiver, Configurable Voltage Translation, 3-State Outputs 48-TSSOP -40 to 85

For a full list of alternate parts for CLVC16T245MDGGEP, check out FindChips.com