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CLVC1G125MDCKREP - Texas Instruments

Description: Enhanced Product Single Bus Buffer Gate With 3-State Outputs

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CLVC1G125MDCKREP - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - sc 70(dck)
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CLVC1G125MDCKREP - Texas Instruments  - 3D model - SOT23 (5-Pin) - sc 70(dck)
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CLVC1G125MDCKREP Details

  • Manufacturer Part Number:

    CLVC1G125MDCKREP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    5

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Control Type:

    ENABLE LOW

  • Count Direction:

    UNIDIRECTIONAL

  • Family:

    LVC/LCX/Z

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS DRIVER

  • Max I(ol):

    0.032 A

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    1

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP5/6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.01 mA

  • Prop. Delay@Nom-Sup:

    4.9 ns

  • Propagation Delay (tpd):

    4.9 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.25 mm

CLVC1G125MDCKREP Frequently Asked Questions (FAQs)

  • A good PCB layout for the CLVC1G125MDCKREP involves keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device. TI provides a recommended layout in the datasheet and application notes.
  • To ensure the CLVC1G125MDCKREP operates within its specified temperature range, provide adequate heat sinking, avoid overheating, and ensure good airflow around the device. Monitor the device's junction temperature (TJ) and keep it below the maximum rating of 150°C.
  • Exceeding the maximum ratings of the CLVC1G125MDCKREP can lead to reduced reliability, permanent damage, or even device failure. This includes exceeding the maximum voltage, current, or temperature ratings, as well as incorrect pin connections or handling.
  • To troubleshoot issues with the CLVC1G125MDCKREP, start by verifying the power supply voltage, checking for proper pin connections, and ensuring the device is operated within its specified temperature range. Use oscilloscopes or logic analyzers to debug signal integrity issues, and consult TI's application notes and support resources for guidance.
  • Yes, the CLVC1G125MDCKREP is sensitive to electrostatic discharge (ESD). Handle the device with ESD-protective equipment, such as wrist straps, mats, and bags, and follow proper handling and storage procedures to prevent ESD damage.

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CLVC1G125MDCKREP Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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