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CLVC1G126IDCKREP - Texas Instruments

Description: Enhanced Product Single Bus Buffer Gate With 3-State Outputs

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PCB Footprints
CLVC1G126IDCKREP - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DCK(R-PDSO-G5)
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CLVC1G126IDCKREP - Texas Instruments  - 3D model - SOT23 (5-Pin) - DCK(R-PDSO-G5)
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CLVC1G126IDCKREP Details

  • Manufacturer Part Number:

    CLVC1G126IDCKREP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Control Type:

    ENABLE HIGH

  • Count Direction:

    UNIDIRECTIONAL

  • Family:

    LVC/LCX/Z

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS DRIVER

  • Max I(ol):

    0.032 A

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    1

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP5/6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.01 mA

  • Prop. Delay@Nom-Sup:

    4.5 ns

  • Propagation Delay (tpd):

    8 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.25 mm

CLVC1G126IDCKREP Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good PCB design practices, such as using a solid ground plane, minimizing trace lengths, and avoiding vias under the device. Additionally, ensure that the input and output capacitors are placed close to the device.
  • The CLVC1G126IDCKREP has a thermal pad on the bottom, which should be connected to a solid ground plane or a thermal relief pattern on the PCB. Ensure good airflow around the device, and consider using a heat sink or thermal interface material if the device will be operating in high-temperature environments.
  • The recommended input capacitor value is 10uF to 22uF, with an X5R or X7R dielectric type. The capacitor should be placed as close to the VIN pin as possible, and its voltage rating should be at least 1.5 times the maximum input voltage.
  • The CLVC1G126IDCKREP is an automotive-grade device, but it's essential to review the device's AEC-Q100 qualification and ensure that it meets the specific requirements of your application. Additionally, follow proper design and manufacturing practices to ensure the device operates within its specified parameters.
  • Start by reviewing the datasheet and application notes to ensure that the device is being used within its specified parameters. Check the input voltage, output voltage, and current consumption to identify any anomalies. Use oscilloscopes or logic analyzers to debug the device's behavior, and consult Texas Instruments' support resources or forums for additional guidance.

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CLVC1G126IDCKREP Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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