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CLVC1G175MDCKREP - Texas Instruments

Description: Enhanced Product Single D-Type Flip-Flop With Asynchronous Clear

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PCB Footprints
CLVC1G175MDCKREP - Texas Instruments PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - DCK (R-PDSO-G6)
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3D Models
CLVC1G175MDCKREP - Texas Instruments  - 3D model - SOT23 (6-Pin) - DCK (R-PDSO-G6)
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CLVC1G175MDCKREP Details

  • Manufacturer Part Number:

    CLVC1G175MDCKREP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOP-6

  • Pin Count:

    6

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Family:

    LVC/LCX/Z

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    D FLIP-FLOP

  • Max Frequency@Nom-Sup:

    150000000 Hz

  • Max I(ol):

    0.032 A

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.01 mA

  • Prop. Delay@Nom-Sup:

    8 ns

  • Propagation Delay (tpd):

    16 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trigger Type:

    POSITIVE EDGE

  • Width:

    1.25 mm

  • fmax-Min:

    150 MHz

CLVC1G175MDCKREP Frequently Asked Questions (FAQs)

  • The recommended land pattern for the CLVC1G175MDCKREP can be found in the Texas Instruments Capacitor Layout Guidelines document, which provides detailed information on pad layout, spacing, and geometry.
  • The CLVC1G175MDCKREP is a moisture-sensitive device. To handle it safely, follow the guidelines outlined in the IPC/JEDEC J-STD-033 standard, which provides procedures for handling and storing moisture-sensitive devices.
  • The maximum operating temperature for the CLVC1G175MDCKREP is 125°C, as specified in the datasheet. Operating the device above this temperature may affect its performance and reliability.
  • The CLVC1G175MDCKREP is designed to withstand moderate vibration levels. However, if your application involves extreme vibration, you may need to consider additional mechanical support or vibration damping measures to ensure the device's reliability.
  • To ensure the CLVC1G175MDCKREP's reliability in a high-humidity environment, follow the recommended storage and handling procedures, and consider applying a conformal coating to protect the device from moisture.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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