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CLVC1G175MDCKREPG4 - Texas Instruments

Description: SINGLE D-TYPE FLIP-FLOP WITH ASYNCHRONOUS CLEAR

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CLVC1G175MDCKREPG4 - Texas Instruments - PCB symbol
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PCB Footprints
CLVC1G175MDCKREPG4 - Texas Instruments PCB footprint - Other - Other - SOT65P210X110-6N
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CLVC1G175MDCKREPG4 - Texas Instruments - 3D model - Other - SOT65P210X110-6N
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CLVC1G175MDCKREPG4 Details

  • Manufacturer Part Number:

    CLVC1G175MDCKREPG4

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOP-6

  • Pin Count:

    6

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Family:

    LVC/LCX/Z

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    D FLIP-FLOP

  • Max Frequency@Nom-Sup:

    150000000 Hz

  • Max I(ol):

    0.032 A

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.01 mA

  • Prop. Delay@Nom-Sup:

    8 ns

  • Propagation Delay (tpd):

    16 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trigger Type:

    POSITIVE EDGE

  • Width:

    1.25 mm

  • fmax-Min:

    150 MHz

CLVC1G175MDCKREPG4 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the CLVC1G175MDCKREPG4 can be found in the Texas Instruments Capacitor Land Pattern document (SLUU323). It provides detailed information on the recommended pad layout and dimensions for optimal soldering and reliability.
  • The CLVC1G175MDCKREPG4 is a moisture-sensitive device (MSD). To prevent damage, it's essential to follow proper handling and storage procedures, such as storing the components in a dry environment, using a dry pack or desiccant, and baking the components before reflow soldering if they've been exposed to moisture.
  • The maximum reflow temperature for the CLVC1G175MDCKREPG4 is 260°C, with a peak temperature not exceeding 240°C. Exceeding this temperature can cause damage to the capacitor or affect its reliability.
  • While the CLVC1G175MDCKREPG4 is a robust component, it's essential to consider the vibration and shock requirements of your specific application. Texas Instruments recommends following the guidelines outlined in the IEC 60068-2-6 standard for vibration testing and ensuring the capacitor is properly secured to the PCB to prevent mechanical stress.
  • The ESR of the CLVC1G175MDCKREPG4 can be determined by measuring the impedance of the capacitor at high frequencies (e.g., 100 kHz) using an impedance analyzer or a network analyzer. The ESR can also be estimated using the capacitor's datasheet values and the following formula: ESR = (ESL / (2 * π * f * C)), where ESL is the equivalent series inductance, f is the frequency, and C is the capacitance.

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CLVC1G175MDCKREPG4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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